복수 타입의 웨이퍼 혼류생산을 위한 클러스터 장비 로봇 운영 최적화
Optimization for robot operations in cluster tools for concurrent manufacturing of multiple wafer types
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Cluster tools are extensively employed in various wafer fabrication processes within the semiconductor manufacturing industry, including photo lithography, etching, and chemical vapor deposition. Contemporary fabrication facilities encounter customer orders with technical specifications that are similar yet slightly varied. Consequently, modern fabrications concurrently manufacture two or three different wafer types using a cluster tool to maximize chamber utilization and streamline the flow of wafer lots between different process stages. In this review, we introduce two methods of concurrent processing of multiple wafer types: 1) concurrent processing of multiple wafer types with different job flows, 2) concurrent processing of multiple wafer types with identical job flows. We describe relevant research trends and achievements and discuss future research directions.
Abstract
Cluster tools are extensively employed in various wafer fabrication processes within the semiconductor manufacturing industry, including photo lithography, etching, and chemical vapor deposition. Contemporary fabrication facilities encounter customer orders with technical specifications that are similar yet slightly varied. Consequently, modern fabrications concurrently manufacture two or three different wafer types using a cluster tool to maximize chamber utilization and streamline the flow of wafer lots between different process stages. In this review, we introduce two methods of concurrent processing of multiple wafer types: 1) concurrent processing of multiple wafer types with different job flows, 2) concurrent processing of multiple wafer types with identical job flows. We describe relevant research trends and achievements and discuss future research directions.
참고문헌 (22)
- Lee, T. E., "Semiconductor Manufacturing Automation" (2023), Springer Nature
- Lee, T. E., "An extended event graph with negative places and tokens for time window constraints", IEEE Trans. Autom. Sci. Eng, 2(4), pp.319~332 (2005)
- Jung, C., "A branch and bound algorithm for cyclic scheduling of timed Petri nets", IEEE Trans. Autom. Sci. Eng, 12(1), pp.309~323 (2015)
- Lee, T. E., "Steady state analysis of timed event graphs with time window constraints", Discrete Appl. Math, 167, pp.202~216 (2014)
- Lee, J. H., "Scheduling cluster tools for concurrent processing of two wafer types", IEEE Trans. Autom. Sci. Eng, 11(2), pp.525~536 (2014)
- Lee, J. H., "Scheduling cluster tools for concurrent processing of two wafer types with PM sharing", IEEE Trans. Autom. Sci. Eng, 53(19), pp.6007~6022 (2015)
- Ko, S. G., "Scheduling Dual-Armed Cluster Tools for Concurrent Processing of Multiple Wafer Types With Identical Job Flows", IEEE Trans. Autom. Sci. Eng, 16(3), pp.1058~1070 (2019)
- Ko, S. G., "Wafer Delay Analysis and Workload Balancing of Parallel Chambers for Dual-Armed Cluster Tools With Multiple Wafer Types", IEEE Trans. Autom. Sci. Eng, 18(3), pp.1516~1526 (2021)
- Kim, T. K., "Scheduling start-up and close-down periods of dual-armed cluster tools with wafer delay regulation", Int. J. Prod. Res, 50(10), pp.2785~2795 (2012)
- Yu, T. S., "Scheduling single-armed cluster tools with chamber cleaning operations", IEEE Trans. Autom. Sci. Eng, 15(2), pp.705~716 (2018)
- Yu, T. S., "Wafer delay analysis and control of dual-armed cluster tools with chamber cleaning operations", IEEE Trans. Autom. Sci. Eng, pp.434~447 (2020)
- Lee, T. E, "A review of scheduling theory and methods for semiconductor manufacturing cluster tools", Proceedings of the 2008 Winter Simulation Conf, pp.2127~2135 (2008)
- Roh, J. E., "A reinforcement learning approach to scheduling dual-armed cluster tools with time variations", Proceedings of the 16th Int. Conf. on Modeling and Applied Simulation, pp.1~6 (2017)
- Kim, D. Y., "Reentrant flow shop scheduling using reinforcement learning", Proceedings of 16th IEEE Int. Conf. on Autom. Sci. Eng, pp.1646~1647 (2020)
- Kim, H. J., "Noncyclic scheduling of cluster tools with a branch and bound algorithm", IEEE Trans. Autom. Sci. Eng, 12(2), pp.690~700 (2015)
- Pan, C., "Scheduling and optimization of mixed-processing with multi-variety wafers in dual-armed cluster tools", J. Chin. Inst. Eng, 41(6), pp.463~472 (2018)
- Lu, Y., "Modeling and Control for Deadlock-Free Operation of Single-Arm Cluster Tools With Concurrently Processing Multiple Wafer Types via Petri Net", IEEE Access, 9, pp.70868~70883 (2021)
- Wang, J., "A cyclic scheduling approach to single-arm cluster tools with multiple wafer types and residency time constraints", IEEE Trans. Autom. Sci. Eng, 16(3), pp.1373~1386 (2019)
- Fu, J., "Intelligent Scheduling Methods for Challenges of Cluster Tools with Concurrent Processing of Multiple Wafer Types", Proceedings of 16th IEEE Int. Conf. on Autom. Sci. Eng, pp.173~178 (2020)
- Ko, S. G., "Scheduling Cluster Tools for Concurrent Processing of Multiple Wafer Types with Identical Job Flows", Doctorate, pp.2018
- Dawande, M., "On throughput maximization in constant travel-time robotic cells", Manuf. Service Oper. Manag, 4(4), pp.296~312 (2002)
- Sriskandarajah, C., "Chandrasekaran, R., 2004, Scheduling multiple parts in a robotic cell served by a dual-gripper robot", Oper. Res, 52(1), pp.65~82 (2004)
