반도체 클러스터 장비에서 웨이퍼 이동지연을 허용하는 스케줄링 방법
A Scheduling Method with Wafer Transfer Delay in the Cluster Tool Process
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초록
차세대 반도체 생산을 위한 450mm 웨이퍼 제조공정의 가장 큰 특징은 모든 제조공정이 완전자동화로 이루어진다는 것이다. 이러한 완전자동화로 인해 작업자의 공정개입이 불가능하게 되고 개별 웨이퍼의 중요도가 증가하므로 완전자동화를 지원할 수 있는 보다 우수한 스케줄링 방법과 시스템이 요구된다. 즉, 450mm 웨이퍼 생산을 위한 스케줄링 시스템은 개별 웨이퍼와 클러스터 장비의 공정 상태를 실시간으로 반영하여 생산성을 향상시킬 수 있는 견고한 스케줄링 기법을 적용해야 한다. 본 연구에서는 450mm 웨이퍼 생산환경에서 중요하게 사용되는 클러스터 장비와 그 특성들을 소개하고 timetabling 방법에 기반을 둔 효과적인 실시간 스케줄링 기법을 제시하고자 한다. 특히 웨이퍼가 공정완료 이후 chamber에서 일정한 시간동안 대기할 수 있는 웨이퍼 이동지연을 고려하여 FOUP 단위의 사이클 타임(cycle time)과 개별 웨이퍼의 공정 시작시간을 결정할 수 있는 방법을 제시한다.
Abstract
In the next generation fab environment for 450mm wafer production, one of the most significant features is the adoption of full automation to the whole manufacturing processes involved. So, it is necessary to construct more robust scheduling system for the entire semiconductor manufacturing processes since the full automation system prevents the process engineers from intervening the manufacturing processes as much as possible and the importance of each individual wafer noticeably increases. The scheduling system for 450mm wafer production also should be capable of monitoring the status of each individual wafer and collecting useful fab data in real time. In this study, we first introduce the cluster tool mainly used in 450mm wafer production, and then propose an effective real-time scheduling algorithm based on the timetabling method. Especially, our method considers the case that the wafer is assumed to be able to stay at the current chamber prior to proceed to the next chamber for a while, which increases the flexibility to assign the starting times of the processes.
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