Fine-pitch 소자 적용을 위한 bumpless 배선 시스템
Bumpless Interconnect System for Fine-pitch Devices
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초록
The demand for fine-pitch devices is increasing due to an increase in I/O pin count, a reduction in powerconsumption, and a miniaturization of chip and package. In addition non-scalability of Cu pillar/Sn cap or Pb-free solderstructure for fine-pitch interconnection leads to the development of bumpless interconnection system. Few bumplessinterconnect systems such as BBUL technology, SAB technology, SAM technology, Cu-toCu thermocompressiontechnology, and WOW's bumpless technology using an adhesive have been reviewed in this paper: The key requirementsfor Cu bumpless technology are the planarization, contamination-free surface, and surface activation.
Abstract
The demand for fine-pitch devices is increasing due to an increase in I/O pin count, a reduction in powerconsumption, and a miniaturization of chip and package. In addition non-scalability of Cu pillar/Sn cap or Pb-free solderstructure for fine-pitch interconnection leads to the development of bumpless interconnection system. Few bumplessinterconnect systems such as BBUL technology, SAB technology, SAM technology, Cu-toCu thermocompressiontechnology, and WOW's bumpless technology using an adhesive have been reviewed in this paper: The key requirementsfor Cu bumpless technology are the planarization, contamination-free surface, and surface activation.
참고문헌 (32)
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