150oC 이하 저온에서의 미세 접합 기술
Low Temperature bonding Technology for Electronic Packaging
3
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
Recently, flip chip interconnection has been increasingly used in microelectronic assemblies. The common Flip chip interconnection is formed by reflow of the solder bumps. Lead-Tin solders and Tin-based solders are most widely used for the solder bump materials. However, the flip chip interconnection using these solder materials cannot be applied to temperature-sensitive components since solder reflow is performed at relatively high temperature. Therefore the development of low temperature bonding technologies is required in these applications. A few bonding techniques at low temperature of 150oC or below have been reported. They include the reflow soldering using low melting point solder bumps, the transient liquid phase bonding by inter-diffusion between two solders, and the bonding using low temperature curable adhesive. This paper reviews various low temperature bonding methods.
Abstract
Recently, flip chip interconnection has been increasingly used in microelectronic assemblies. The common Flip chip interconnection is formed by reflow of the solder bumps. Lead-Tin solders and Tin-based solders are most widely used for the solder bump materials. However, the flip chip interconnection using these solder materials cannot be applied to temperature-sensitive components since solder reflow is performed at relatively high temperature. Therefore the development of low temperature bonding technologies is required in these applications. A few bonding techniques at low temperature of 150oC or below have been reported. They include the reflow soldering using low melting point solder bumps, the transient liquid phase bonding by inter-diffusion between two solders, and the bonding using low temperature curable adhesive. This paper reviews various low temperature bonding methods.
참고문헌 (55)
- J. H. Lau, "Flip chip technologies" (1996), McGraw-Hill Professional
- M. Abtew, "Lead-free solders in microelectronics", Materials Science and Engineering R: Reports, 27(5), pp.95~ (2000)
- E. E. M. Noor, "Wettability and strength of In-Bi-Sn leadfree solder alloy on copper substrate", Journal of Alloys and Compounds, 507(1), pp.290~ (2010)
- U. B. Kang, "A new COG technique using low temperature solder bumps for LCD driver IC packaging applications", IEEE Transactions on Components and Packaging Technologies, 27(2), pp.253~ (2004)
- Young-Gon Lee, "Electrodeposition of the Sn-58 wt.%Bi Layer for Low-Temperature Soldering", Metals and Materials International, 17(1), pp.117~121 (2011), 대한금속·재료학회
- S. Logothetidis, "Flexible organic electronic devices: Materials, process and applications", Materials Science and Engineering B: Solid-State Materials for Advanced Technology, 152(1), pp.96~ (2008)
- 권동일, "A Guide to Lead-free Solders: Physical Metallurgy and Reliability" (2007), Springer
- H. T. Lee, "Microstructural evolution of Sn-3.5Ag solder with lanthanum addition", pp.617~ (2009)
- B. R. Flachsbart, "Fluxless Sn-Ag solder ball formation for flip-chip application, in: R. Feldman Michael, In Society of Photo-Optical Instrumentation Engineers", pp.54~ (1996)
- H. Mavoori, "Mechanical behavior of eutectic Sn-Ag and Sn- Zn solders", pp.161~ (1995), Materials Research Society
- H. Mavoori, "Creep, stress relaxation, and plastic deformation in Sn- Ag and Sn-Zn eutectic solders", Journal of Electronic Materials, 26(7), pp.783~ (1997)
- R. K. Chinnam, "Evolution of the microstructure of Sn-Ag-Cu solder joints exposed to ultrasonic waves during solidification", Acta Materialia, 59(4), pp.1474~ (2011)
- M. Erinc, "Intergranular thermal fatigue damage evolution in SnAgCu lead-free solder", Mechanics of Materials, 40(10), pp.780~ (2008)
- W. Zhou, "Microstructure of Sn-Ag- Cu lead-free flip chip interconnects during aging", Proc. 6th International conference on Electronic Packaging Technology (ICEPT 2005), pp.427~ (2005)
- Y. H. Tian, "Evolution of microstructure of Sn-Ag-Cu lead-free flip chip solder joints during aging process", Acta Metallurgica Sinica (English Letters), 19(4), pp.301~ (2006)
- K. Suganuma, "Sn-Zn low temperature solder", Journal of Materials Science: Materials in Electronics, 18(1), pp.121~ (2007)
- U. R. Kattner, "Phase diagrams for lead-free solder alloys", JOM, 54(12), pp.45~ (2002)
- Z. Mei, "Characterization of eutectic Sn-Bi solder joints", Journal of Electronic Materials, 21(6), pp.599~ (1992)
- K. Shimizu, "Solder joint reliability of indium-alloy interconnection", Journal of Electronic Materials, 24(1), pp.39~ (1995)
- J. H. Choi, "Contact resistance of the chip-on-glass bonded 48Sn-52In solder joint", Materials Transactions, 46(5), pp.1042~ (2005)
- C. Y. Huang, "Interfacial reactions in In-Sn", Ni couples and phase equilibria of the In-Sn-Ni system, 2002, pp.31(2), 152~
- S. K. Kang, "Lead (Pb)-free solders for electronic packaging", Journal of Electronic Materials, 23(8), pp.701~ (1994)
- M. S. Lee, "A new low temperature bonding technique using In and Sn solder bumps", Proc. International conference on Electronic Materials and Packaging (EMAP 2003), pp.93~ (2003)
- S. H. Lee, "Shear strength of fluxless solder joints between Sn and in bumps", Key Engineering Materials, 297, pp.857~ (2005)
- ChinC.Lee, "Low Temperature Fluxless Bonding Technique Using In", Sn Composite, 2000, 114~118
- C. C. Lee, "Fluxless In-Sn bonding process at 140oC", Materials Science and Engineering A, 333(1), pp.45~ (2002)
- Y. Li, "Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications", Materials Science and Engineering R: Reports, 51(1), pp.1~ (2006)
- I. Mir, "Recent advances in isotropic conductive adhesives for electronics packaging applications", International Journal of Adhesion and Adhesives, 28(7), pp.362~ (2008)
- K. Dai, "Easy and Large Scale Synthesis Silver Nanodendrites: Highly Effective Filler for Isotropic Conductive Adhesives", Journal of Materials Engineering and Performance, 21(3), pp.353~ (2011)
- H. P. Wu, "High conductivity of isotropic conductive adhesives filled with silver nanowires", International Journal of Adhesion and Adhesives, 26(8), pp.617~ (2006)
- H. H. Lee, "Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives", International Journal of Adhesion and Adhesives, 25(5), pp.437~ (2005)
- H. P. Wu, "Properties investigation on isotropical conductive adhesives filled with silver coated carbon nanotubes", Composites Science and Technology, 67(6), pp.1182~ (2007)
- S. K. Kang, "Development of high conductivity lead (Pb)-free conducting adhesives", IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 21(1), pp.18~ (1998)
- L. Ye, "Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives", IEEE Transactions on Electronics Packaging Manufacturing, 22(4), pp.299~ (1999)
- Y. C. Chan, "Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature", Microelectronics Reliability, 42(8), pp.1185~ (2002)
- M. J. Rizvi, "The effect of curing on the performance of ACF bonded chip-onflex assemblies after thermal ageing", Soldering and Surface Mount Technology, 17(2), pp.40~ (2005)
- M. A. Uddin, "Adhesion strength and contact resistance of flip chip on flex packages - Effect of curing degree of anisotropic conductive film", Microelectronics Reliability, 44(3), pp.505~ (2004)
- K. Lee, "Room temperature ACF bonding process using ultrasonic vibration for chip-on-board and flex-on-board applications", Proc. International Conference on Electronic Materials and Packaging (EMAP 2007), pp.1~ (2007)
- K. Lee, "Highspeed flex-on-board assembly method using anisotropic conductive films (ACFs) combined with room temperature ultrasonic (US) bonding for high-density module interconnection in mobile phones", Electronic Components and Technology Conference (ECTC), pp.530~ (2011)
- C. M. Lin, "Analysis of new anisotropic conductive film (ACF)", IEEE Transactions on Device and Materials Reliability, 5(4), pp.694~ (2005)
- 홍명환, "Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)", Current Applied Physics, 12(3), pp.612~615 (2012), 한국물리학회
- 백경욱, "Highly reliable non-conductive adhesives for flip chip CSP applications", IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 26(2), pp.150~155, IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- L. K. Teh, "Development and reliability of non-conductive adhesive flip-chip packages", Thin Solid Films, 462, pp.446~ (2004)
- L. K. Teh, "Characterization of Nonconductive Adhesives for Flip-Chip Interconnection", Journal of Electronic Materials, 33(4), pp.271~ (2004)
- Y. C. Chan, "Electrical characterization of NCP- and NCF-bonded fine-pitch flipchip- on-flexible packages", IEEE Transactions on Advanced Packaging, 30(1), pp.142~ (2007)
- H. C. Cheng, "Process- dependent contact characteristics of NCA assemblies", IEEE Transactions on Components and Packaging Technologies, 27(2), pp.398~ (2004)
- B. Y. Kim, "Chip-on-glass bonding using sn bump and non-conductive adhesive for LCD application", Molecular Crystals and Liquid Crystals, 458(1), pp.199~ (2006)
- K. M. Harr, "A new COF bonding technique using Sn bumps and a non-conductive adhesive (NCA) for image sensor packaging", Electronic Components and Technology Conference (ECTC), pp.1475~ (2009)
- B. G. Kim, "Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn", Cu bumps and non-conductive adhesives, 2011, pp.51(4), 851~
- B. G. Kim, "The reliability of 30 μm pitch COG joints fabricated using Sn", Cu bumps and non-conductive adhesive, 2007, 1~
- Z. G. Chen, "A new COP bonding using nonconductive adhesives for LCDs driver IC packaging", Displays, 27(3), pp.130~ (2006)
- K. Tanida, "Au bump interconnection with ultrasonic flip-chip bonding in 20 μm pitch", Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 42(4), pp.2198~ (2003)
- A. Shigetou, "Bumpless interconnect of ulrafine Cu electrodes by surface activated bonding (SAB) method", Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi), 89(12), pp.34~ (2006)
- T. H. Kim, "Room temperature Cu-Cu direct bonding using surface activated bonding method", Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, 21(2), pp.449~ (2003)
- T. Suga, "Feasibility of surface activated bonding for ultrafine pitch interconnection - a new concept of bump-less direct bonding for system level packaging", Electronic Components and Technology Conference (ECTC), pp.702~ (2000)
