Evaluation of ENEPIG surface treatment for high-reliability PCB in mobile module

Abstract

We evaluated characteristic of surface treatment of ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) for mobile equipment that high reliability is required, in addition to surface treatment process for semiconductors board that is required to high reliability such as regular PCB-package systems, board-on-chip, chip-scaled package (CSP), etc or application for semiconductor package board of SIP, BOC, as the result, it appeared that ENEPIG has more outstanding characteristic than ENIG surface treatment when performing corrosion resistance, solder junction, wetting, etc. We anticipate that it'll be able to contribute to their credibility and improvement for low-cost reduction for producing mobile devices such as the cell phones when applying to expansion of process as low-cost domestic medicine.