미세피치 패키지 적용을 위한 thin ENEPIG 도금층의 솔더링 특성
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초록
본 연구에서는 미세피치 패키지 적용을 위한 기초 실험으로 thin ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold) 도금층을 형성하여 솔더링 특성을 평가하였다. 먼저, Sn-3.0Ag-0.5Cu (SAC305) 솔더합금에대한 thin ENEPIG 도금층의 젖음 특성이 평가되었으며, 순차적인 솔더와의 반응에 대한 계면반응 및 솔더볼 접합 후 고속 전단 시험을 통한 접합부 기계적 신뢰성이 평가되었다. 젖음성 시험에서 침지 시간이 증가함에 따라 최대 젖음력은 증가하였으며, 5초의 침지 시간 이후에는 최대 젖음력이 일정하게 유지되었다. 초기 계면 반응 동안에는 (Cu,Ni)6Sn5 금속간화합물과 P-rich Ni 층이 SAC305/ENEPIG 계면에서 관찰되었다. 연장된 계면반응 후에는 P-rich Ni 층이 파괴 되었으며, 파괴된 P-rich Ni 층 아래에는 (Cu,Ni)3Sn 금속간화합물이 생성되었다. 고속 전단 시험의 경우, 전단속도가 증가함에따라 취성 파괴율이 증가하였다.
Abstract
In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, (Cu,Ni)6Sn5 intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and (Cu,Ni)3Sn IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.
참고문헌 (15)
- J. W. Yoon, "Flip-chip Technology and Reliability of Electronic Packaging (in Kor.)", Journal of KWS, 25(2), pp.108~ (2007)
- K. N. Tu, "Reliability challenges in 3D IC packaging technology", Microelectronics Reliability, 51(3), pp.517~ (2011)
- 박동현, "온도", 습도 시험, 온도 싸이클링 시험 및 고온유지 시험에 따른 Package-on-Package의 신뢰성, 2016, pp.23(3), 43~49[DOI]
- T. Laurila, "Interfacial reactions between lead-free solders and common base materials", Materials Science & Engineering R, 49(1), pp.1~ (2005)
- M. Abtewa, "Lead-free Solders in Microelectronics", Materials Science & Engineering R, 27(5), pp.95~ (2000)
- 이순재, "자동차 전장용 무연 솔더 기술", 마이크로전자 및 패키징학회지, 22(3), pp.1~7 (2015), 한국마이크로전자및패키징학회
- Jeong-Won Yoon, "Interfacial reaction and intermetallic compound formation of Sn–1Ag", ENIG and Sn–1Ag, Journal of Alloys and Compounds, pp.2015, 627[DOI]
- M. L. Huang, "Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu", ENEPIG Joints, 2015, pp.31(3), 252~
- J. W. Yoon, "Sequential interfacial intermetallic compound formation of Cu6Sn5 and Ni3Sn4 between Sn–Ag–Cu solder and ENEPIG substrate during a reflow process", Journal of Alloys and Compounds, 509(9), pp.L153~ (2011)
- C. Y. Ho, "Optimal Ni(P) thickness design in ultrathin-ENEPIG metallization for soldering application concerning electrical impedance and mechanical bonding strength", Materials Science & Engineering A, 611, pp.162~ (2014)
- C. Y. Ho, "Quantifying the dependence of Ni(P) thickness in ultrathin-ENEPIG metallization on the growth of Cu-Sn intermetallic compounds in soldering reaction", Materials Chemistry and Physics, 148(1), pp.21~ (2014)
- Han-Byul Kang, "Control of interfacial reaction layers formed in Sn–3.5Ag–0.7Cu", electroless Ni–P solder joints, 2009, pp.60(4), 257~260[DOI]
- J. W. Yoon, "Investigation of interfacial reaction and joint reliability between eutectic Sn–3.5Ag solder and ENIG-plated Cu substrate during high temperature storage test", J. Mater. Sci: Mater. Electron, 18(5), pp.559~ (2007)
- S. S. Ha, "Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test", Journal of Electronic Materials, 38(12), pp.2489~ (2009)
- S. M. Lee, "Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions", J. Mater. Sci: Mater. Electron, 26(3), pp.1649~ (2015)