Maskless Screen Printing Process using Solder Bump Maker (SBM) for Low-cost, Fine-pitch Solder-on-Pad (SoP) Technology
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A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. Itfeatures maskless screen printing process. A selective solder bumping mechanism without the mask is based on thematerial design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solderon-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The processincludes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrateand the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to thepads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the padconfigurations. Through this process, an SoP array on an organic substrate with a pitch of 130 μm is, successfully, formed.
Abstract
A novel bumping process using solder bump maker (SBM) is developed for fine-pitch flip chip bonding. Itfeatures maskless screen printing process. A selective solder bumping mechanism without the mask is based on thematerial design of SBM. Maskless screen printing process can implement easily a fine-pitch, low-cost, and lead-free solderon-pad (SoP) technology. Its another advantage is ternary or quaternary lead-free SoP can be formed easily. The processincludes two main steps: one is the thermally activated aggregation of solder powder on the metal pads on a substrateand the other is the reflow of the deposited powder on the pads. Only a small quantity of solder powder adjacent to thepads can join the first step, so a quite uniform SoP array on the substrate can be easily obtained regardless of the padconfigurations. Through this process, an SoP array on an organic substrate with a pitch of 130 μm is, successfully, formed.
참고문헌 (9)
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