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Impact of gate protection silicon nitride film on the sub-quarter micron transistor performances

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Abstract

Gate protection SiNx as an alternative to a conventional re-oxidation proces in Dynamic Random AcesMemory devices is investigated. This process can not only protect the gate electrode tungsten against oxidation, but alsosave the thermal budget due to the re-oxidation. The protection SiNx process is applied to the poly-Si gate, and its deviceperformance is measured and compared with the re-oxidation processed poly-Si gate. The results on the gate dielectricintegrity show that etch damage-curing capability of protection SiNx is comparable to the re-oxidation process. In addition,the hot carrier immunity of the SiNx deposited gate is superior to that of re-oxidation procesed gate.

참고문헌 (4)

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  2. "In-situ barrier formation for high reliable W", barier, pp.1998[DOI]
  3. "A fuly working 0.14mm DRAM technology with polymetal(W", WNx, pp.2000[DOI]
  4. "he halo nMOSFET characteristics dependent on the gate profile Proc.", pp.484~ (1999)

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