Effect of Microstructure on Alternating Current-induced Damage in Cu Line

참고문헌 (17)

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17. "A New Dislocation Mechanism in Ultrathin Copper Films ybpark@andong.ac.krPAGE 6 Young-Bae ParkEffect of Microstructure on Alternating Current-induced Damage in Cu Lines PAGE 5마이크로전자 및 패키징학회지 제12권 제1호 Journal of the Microelectronics & Packaging SocietyVol. 12", pp.27~332005

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