써멀 그리스의 열전달계수에 따른 CPU 온도변화에 관한 비교
Comparison of CPU Temperature Change According to the Heat Transfer Coefficient of Thermal Grease
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초록
In this study, the effect of thermal grease and heat sink material of cooler on CPU temperature was measured and compared with LinX(v0.9.6) and HWMonitor.When the computer is booted without thermal grease applied, the CPU temperature rises rapidly, and the CPU temperature reaches 100℃ after 60 seconds for aluminum heat sink and 140 seconds for copper heat sink. The CPU temperature is lower as the thermal conductivity coefficient of thermal grease is higher, and the CPU temperature is lower when the thermal conductivity coefficient of the cooler is higher. In addition, when using a thermal grease and a heat sink with a high coefficient of thermal conductivity, the cooler rpm can be lowered, which is considered to be advantageous in terms of system stability and energy saving.
Abstract
In this study, the effect of thermal grease and heat sink material of cooler on CPU temperature was measured and compared with LinX(v0.9.6) and HWMonitor.When the computer is booted without thermal grease applied, the CPU temperature rises rapidly, and the CPU temperature reaches 100℃ after 60 seconds for aluminum heat sink and 140 seconds for copper heat sink. The CPU temperature is lower as the thermal conductivity coefficient of thermal grease is higher, and the CPU temperature is lower when the thermal conductivity coefficient of the cooler is higher. In addition, when using a thermal grease and a heat sink with a high coefficient of thermal conductivity, the cooler rpm can be lowered, which is considered to be advantageous in terms of system stability and energy saving.
참고문헌 (9)
- Hamilton S., "Intel research expands Moore's law", IEEE Computer Society, 36(1), pp.31~40 (2003)
- Vogel, M., "Low Profile Heat Sink Cooling Technologies for Next Generation CPU Thermal Designs", Electronics Cooling, 11(1), pp.20~26 (2005)
- Sang-Hyeok Park, "A Study on Heat Transfer Performance of Thermal Grease with High Thermal Conductivity Materials", 2018 KSME Symposium, pp.1254~1259 (2018)
- J. T. Choi, "Experimental Study of Liquid Cooling System for Computer", 2010 Korean Journal of Air-Conditioning and Refrigeration Engineering Symposium, pp.867~872 (2010)
- MW Seo, "Computer and cooling technology", Journal of the KSME, pp.44~50 (2007)
- 차동안, "컴퓨터 CPU 냉각용 방열기의 열유동특성에 관한 연구", 설비공학 논문집, 23(1), pp.1~7 (2011), 대한설비공학회
- Pecht, M., "Handbook of Electronics Package Design", pp.40~43 (1990), Marcel Dekker, Inc
- Sang-Hyeok Park, "A Study on The Heat Transfer Performance of Thermal Grease Prepared with Nano Powders", 2019 KSME Symposium, pp.37~39 (2019)
- A Ra Choi, "The Impact of Cooling Fan Speed on Temperature of Microprocessors and Power Consumption of Computer Systems", 2010 Journal of KIISE, 37(2), pp.272~275 (2010)
