기판접합기술을 이용한 두꺼운 백플레이트와 수직음향구멍을 갖는 정전용량형 마이크로폰의 설계와 제작
Design and fabrication of condenser microphone with rigid backplate and vertical acoustic holes using DRIE and wafer bonding technology
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Abstract
This paper presents a novel MEMS condenser microphone with rigid backplate to enhance acoustic characteristics. TheMEMS condenser microphone consists of membrane and backplate chips which are bonded together by gold-tin (Au/Sn)eutectic solder bonding. The membrane chip has 2.5 m×2.5 m, 0.5m thick low stress silicon nitride membrane,2mm×2 m Au/Ni/Cr membrane electrode, and 3m thick Au/Sn layer. The backplate chip has 2 m×2 mm, 150mthick single crystal silicon rigid backplate, 1.8 m×1.8 m backplate electrode, and air gap, which is fabricated by bulkmicromachining and silicon deep reactive ion etching. Slots and 50-60m radius circular acoustic holes to reduce air dampingare also formed in the backplate chip. The fabricated microphone sensitivity is 39.8V/Pa (88 dB re. 1 V/Pa) at 1 kHz and28 V polarization voltage. The microphone shows flat frequency response within 1 dB between 20 Hz and 5 kHz.
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