Plasma spray 공정을 이용한 BCuP-5 filler 금속/Ag기판 복합 소재의 제조, 미세조직 및 접합 특성
Fabrication, Microstructure and Adhesive Properties of BCuP-5 Filler Metal/Ag Plate Composite by using Plasma Spray Process
0
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
In this study, we fabricate a thin- and dense-BCuP-5 coating layer, one of the switching device multilayers, through a plasma spray process. In addition, the microstructure and macroscopic properties of the coating layer, such as hardness and bond strength, are investigated. Both the initial powder feedstock and plasma-sprayed BCuP-5 coating layer show the main Cu phase, Cu-Ag-Cu3P ternary phases, and Ag phase. This means that microstructural degradation does not occur during plasma spraying. The Vickers hardness of the coating layer was measured as 117.0 HV, indicating that the fine distribution of the three phases enables the excellent mechanical properties of the plasma-sprayed BCuP-5 coating layer. The pull-off strength of the plasma-sprayed BCuP-5 coating layer is measured as 16.5 kg/cm2. Based on the above findings, the applicability of plasma spray for the fabrication process of low-cost multi-layered electronic contact materials is discussed and suggested.
Abstract
In this study, we fabricate a thin- and dense-BCuP-5 coating layer, one of the switching device multilayers, through a plasma spray process. In addition, the microstructure and macroscopic properties of the coating layer, such as hardness and bond strength, are investigated. Both the initial powder feedstock and plasma-sprayed BCuP-5 coating layer show the main Cu phase, Cu-Ag-Cu3P ternary phases, and Ag phase. This means that microstructural degradation does not occur during plasma spraying. The Vickers hardness of the coating layer was measured as 117.0 HV, indicating that the fine distribution of the three phases enables the excellent mechanical properties of the plasma-sprayed BCuP-5 coating layer. The pull-off strength of the plasma-sprayed BCuP-5 coating layer is measured as 16.5 kg/cm2. Based on the above findings, the applicability of plasma spray for the fabrication process of low-cost multi-layered electronic contact materials is discussed and suggested.
참고문헌 (11)
- F. Findik, , Mater. Des, 24, pp.489~ (2003)
- M. Madej, , Arch. Metall. Mater, 57, pp.605~ (2012)
- A. Ksiazkiewicz, , Poznan University of Technology Academic Journals. Electrical Engineering, 82, pp.207~ (2015)
- H. -Y. Zhang, , Surf. Coat. Tech, 395, pp.125939~ (2020)
- 류호림, "서스펜션 플라즈마 스프레이 코팅법으로 제조된 Ytterbium Silicate 환경차폐코팅의 상형성 및 구조에 미치는 증착인자 및 원료혼합 공정의 영향", 한국분말재료학회지, 24(6), pp.437~443 (2017), 한국분말재료학회[DOI]
- C. Zhang, , Micron, 97, pp.1~ (2017)
- G. -S. Ham, , Mater. Des, 195, pp.109043~ (2020)
- A. Ranjan, , Vacuum, 168, pp.108834~ (2019)
- T. Takemoto, , Trans. JWRI, 16, pp.301~ (1987)
- A. -M. Aminazad, , Proc. Mat. Sci, 11, pp.672~ (2015)
- M. -B. Karamis, , J. Mater. Process. Tech, 141, pp.302~ (2003)