고속 화염 용사 공정을 이용한 스위칭 소자용 BCuP-5 filler 금속/Ag 기판 클래드 소재의 제조, 미세조직 및 접합 특성
Fabrication, Microstructure and Adhesion Properties of BCuP-5 Filler Metal/Ag Plate Clad Material by Using High Velocity Oxygen Fuel Thermal Spray Process
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In this study, a new manufacturing process for a multilayer-clad electrical contact material is suggested. A thin and dense BCuP-5 (Cu-15Ag-5P filler metal) coating layer is fabricated on a Ag plate using a high-velocity oxygen-fuel (HVOF) process. Subsequently, the microstructure and bonding properties of the HVOF BCuP-5 coating layer are evaluated. The thickness of the HVOF BCuP-5 coating layer is determined as 34.8 μm, and the surface fluctuation is measured as approximately 3.2 μm. The microstructure of the coating layer is composed of Cu, Ag, and Cu-Ag-Cu3P ternary eutectic phases, similar to the initial BCuP-5 powder feedstock. The average hardness of the coating layer is 154.6 HV, which is confirmed to be higher than that of the conventional BCuP-5 alloy. The pull-off strength of the Ag/BCup-5 layer is determined as 21.6 MPa. Thus, the possibility of manufacturing a multilayer-clad electrical contact material using the HVOF process is also discussed.
Abstract
In this study, a new manufacturing process for a multilayer-clad electrical contact material is suggested. A thin and dense BCuP-5 (Cu-15Ag-5P filler metal) coating layer is fabricated on a Ag plate using a high-velocity oxygen-fuel (HVOF) process. Subsequently, the microstructure and bonding properties of the HVOF BCuP-5 coating layer are evaluated. The thickness of the HVOF BCuP-5 coating layer is determined as 34.8 μm, and the surface fluctuation is measured as approximately 3.2 μm. The microstructure of the coating layer is composed of Cu, Ag, and Cu-Ag-Cu3P ternary eutectic phases, similar to the initial BCuP-5 powder feedstock. The average hardness of the coating layer is 154.6 HV, which is confirmed to be higher than that of the conventional BCuP-5 alloy. The pull-off strength of the Ag/BCup-5 layer is determined as 21.6 MPa. Thus, the possibility of manufacturing a multilayer-clad electrical contact material using the HVOF process is also discussed.
참고문헌 (17)
- F. Findik, , Mater. Des, 24, pp.489~ (2003)
- M. Madej, , Arch. Metall. Mater, 57, pp.605~ (2012)
- A. Ksiazkiewicz, , Poznan University of Technology Academic Journals. Electrical Engineering, 82, pp.207~ (2015)
- H. Yu, , J. Mater. Sci, 50, pp.324~ (2015)
- W. K. Yoon, "Korea, KR 101394617", ~ (2014)
- 권기봉, "Ag-CdO계 전기접점재료의 미세조직에 미치는 열처리 조건과 산화 공정의 영향", 한국주조공학회지, 25(6), pp.226~232 (2005), 한국주조공학회
- 강현구, "Ag 코팅한 W-Ag 전기접점", Cu 모재간의 브레이징 접합 특성, 2006, pp.13(1), 18~24[DOI]
- M. Magnani, , J. Therm. Spray Techn, 18, pp.353~ (2009)
- L. N. Moskowitz, , J. Therm. Spray Techn, 2, pp.21~ (1993)
- P. Gavendova, , Proc. Mat. Sci, 12, pp.89~ (2016)
- M. Oksa, , Coatings, 1, pp.17~ (2011)
- L. Y. Nan, , T. Nonferr. Metal Soc, 21, pp.394~ (2011)
- T. Takemoto, , Trans. J.W.R.I, 16, pp.301~ (1987)
- M. B. Karamis, , J. Mater. Process. Tech, 141, pp.302~ (2003)
- S. Amin, , Int. J. Cur. Trends Eng. Res, 2, pp.556~ (2016)
- A. Valarezo, , J. Therm. Spray Tech, 19, pp.852~ (2010)
- N. M. Noordin, , Procedia Eng, 184, pp.1~ (2017)