Manufacturing and Macroscopic Properties of Cold Sprayed Cu-Ga Coating Material for Sputtering Target
1
조회
0
다운로드
4
인용
0
참고문헌
키워드
초록
This study attempted to manufacture a Cu-Ga coating layer via the cold spray process and to investigate the applicability of the layer as a sputtering target material. In addition, changes made to the microstructure and properties of the layer due to annealing heat treatment were evaluated, compared, and analyzed. The results showed that coating layers with a thickness of 520 mm could be manufactured via the cold spray process under optimal conditions. With the Cu-Ga coating layer, the α-Cu and Cu3Ga were found to exist inside the layer regardless of annealing heat treatment. The microstructure that was minute and inhomogeneous prior to thermal treatment changed to homogeneous and dense with a more clear division of phases. A sputtering test was actually conducted using the sputtering target Cu-Ga coating layer (~2 mm thickness) that was additionally manufactured via the cold-spray coating process. Consequently,this test result confirmed that the cold sprayed Cu-Ga coating layer may be applied as a sputtering target material.
Abstract
This study attempted to manufacture a Cu-Ga coating layer via the cold spray process and to investigate the applicability of the layer as a sputtering target material. In addition, changes made to the microstructure and properties of the layer due to annealing heat treatment were evaluated, compared, and analyzed. The results showed that coating layers with a thickness of 520 mm could be manufactured via the cold spray process under optimal conditions. With the Cu-Ga coating layer, the α-Cu and Cu3Ga were found to exist inside the layer regardless of annealing heat treatment. The microstructure that was minute and inhomogeneous prior to thermal treatment changed to homogeneous and dense with a more clear division of phases. A sputtering test was actually conducted using the sputtering target Cu-Ga coating layer (~2 mm thickness) that was additionally manufactured via the cold-spray coating process. Consequently,this test result confirmed that the cold sprayed Cu-Ga coating layer may be applied as a sputtering target material.
참고문헌 (21)
- M. Kaelin., , Thin Solid Films, 431, pp.58~ (2003)
- M. Nouiri., , Mater. Sci. Eng. C, 27, pp.1002~ (2007)
- K. Sakurai., , Thin Solid Films, 431, pp.6~ (2003)
- T. Nakano., , Thin Solid Films, 334, pp.192~ (1998)
- J. W. Lim., , Surf. Coat. Techno, 201, pp.1899~ (2006)
- J. Sarkar., , Thin Solid Films, 517, pp.1970~ (2009)
- M. Moriyama., , Mater. Trans, 46, pp.1036~ (2005)
- K. J. Kardokus., "Copper Sputtering Target Assembly and Method of Making same", U.S. Patent 6, 645,427, ~ (2003)
- C. F. Lo., , J. Eelectro. Mater, 34, pp.1468~ (2005)
- H. Thomasv., , Key Eng. Mater, 197, pp.59~ (2001)
- A. Papyrin, , Adv. Mater. Proc, 159, pp.49~ (2001)
- H. J. Kim., , Journal of KWS, 20, pp.53~ (2002)
- Y. M. Jin., , J. Therm. Spray Techn, 20, pp.497~ (2011)
- 권성희, "저온 분사 코팅법으로 제조된 Cu 코팅층의 미세조직 및 물성연구", 대한금속·재료학회지, 45(4), pp.216~223 (2007), 대한금속·재료학회
- W. Kroemmer., "Thermal Spray 2003", pp.97~ (2003), ASM International
- O. Volobujeva., , Solar Energy Mater. & Solar Cell, 93, pp.11~ (2009)
- 오익현, "스퍼터링 타겟재의 응용을 목적으로 하는 탄탈륨 소결체의 제작 및 평가", 한국재료학회지, 18(4), pp.181~186 (2008), 한국재료학회
- B. Gabbitas., , Maters. Sci. Forum, 534, pp.805~ (2007)
- T. Stoltenhoff., , Surf. Coat. Tech, 200, pp.4947~ (2006)
- H. Pop., , Acta Metall, 13, pp.1021~ (1965)
- 권성희, "저온 분사 코팅법으로 제조된 Cu", CNT 복합코팅층의 미세조직 및 물성연구, 2008, pp.46(3), 182~188[DOI]