Metal과 Metal Oxidefh 구성된 복합구조의 Peel Strength
Peel strengths of the Composite Structure of Metal and Metal Oxide Laminate
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양극산화(anodization)공정으로 제작된 규칙성 나노구조의 다공성 산화알루미늄(Aluminum Anodic Oxide,AAO)는 공정이 적용된 LED 모듈은 비교적 쉽고 경제적이므로 최근 LED용 방열소재로 응용하기 위하여 다양하게 연구가 진행되고 있다. 일반적으로 LED 모듈은 알루미늄/폴리머/구리 회로층으로 구성되며 절연체 역할을 하는 폴리머는 히트스프레더로 구성되어있다. 그러나 열전도도가 낮은 폴리머로 인하여 LED부품의 열 방출이 원활하지 못하므로 LED의수명단축 및 오작동에 영향을 미친다. 따라서, 본 연구에서는 폴리머 대신 상대적으로 열전도도가 우수한 AAO를 양극산화 공정으로 제작하여 히트스프레더(heat spread)로 사용하였다. 이때, AAO와 금속인 구리 회로층간의 접착력을 향상시키기 위하여 스퍼터링 DBC(direct bonding copper)법으로 시드층(seed layer)을 형성한 뒤 최종적으로 전해도금공정으로구리회로층을 형성하였다. 본 연구에서는 양극 산화공정으로 AAO와 금속간의 접착강도를 개선하여 1.18~1.45 kgf/cm와같은 우수한 peel strength 값을 얻었다.
Abstract
A lot of various researches have been going on to use heat spreader for LED module. Nano porous aluminumanodic oxide (AAO) applied LED, which is produced from anodization, is easy and economically advantageous. Convensional LED module is consist of aluminum/adhesive/copper circuit. The polymer adhesive in this module is usedas heat spreader. However the thermal emission of LED component is degraded because of low heat conductivity ofpolymer and also reliability of LED component is reduced. Therefore, AAO in this work was applied to heat spreaderof LED module which has higher heat conductivity compare to polymer. Bonding strength between AAO and coppercircuit was improved with Ti/Cu seed layer by copper sputtering process (DBC) before the bonding. And this coppercircuit has been fabricated by electro plating method. Peel strength of AAO and copper circuit in this work showed rangebetween 1.18~1.45 kgf/cm with anodizing process which is very suitable for high power LED application.
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