알루미늄 합금의 복사방열향상을 위한 코팅연구
The Study on Coatings to Improve the Radiative Heat Dissipation of Aluminum Alloy
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The aim of the present study was to improve the radiative heat dissipation of aluminum alloy, Al 1050. Resin/CuO coating and Cu/CuO composite plating were applied on aluminum alloy to improve the radiativeheat dissipation. Resin/CuO coating was made using thermosetting silicon resin and Cu/CuO composite platingwas made in pyrophosphate copper plating bath. Radiant heat flux(W/m2) was measured by self-producedradiant heat measurement device to compare each specimen. The cross section of specimen and chemicalbonding of surface were analyzed by FE-SEM, XPS and FT-IR. As a result, radiant heat of Resin/CuO coatingwas higher than Cu/CuO composite plating due to the adhesion with aluminum plate and the difference inchemical bonding. But, Both of them were higher than aluminum alloy. In order to confirm the result ofexperiment, aluminum plate, Resin/CuO coating and Cu/CuO composite plating sample were applied LEDand measured the LED temperature. As a result, LED temperature of samples were matched previous resultsand confirmed coated samples were lower about 10 degrees than the aluminum alloy.
Abstract
The aim of the present study was to improve the radiative heat dissipation of aluminum alloy, Al 1050. Resin/CuO coating and Cu/CuO composite plating were applied on aluminum alloy to improve the radiative heat dissipation. Resin/CuO coating was made using thermosetting silicon resin and Cu/CuO composite plating was made in pyrophosphate copper plating bath. Radiant heat flux(W/m2) was measured by self-produced radiant heat measurement device to compare each specimen. The cross section of specimen and chemical bonding of surface were analyzed by FE-SEM, XPS and FT-IR. As a result, radiant heat of Resin/CuO coating was higher than Cu/CuO composite plating due to the adhesion with aluminum plate and the difference in chemical bonding. But, Both of them were higher than aluminum alloy. In order to confirm the result of experiment, aluminum plate, Resin/CuO coating and Cu/CuO composite plating sample were applied LED and measured the LED temperature. As a result, LED temperature of samples were matched previous results and confirmed coated samples were lower about 10 degrees than the aluminum alloy.
참고문헌 (12)
- D. Heroedu, "Basic Far-infrared Radiation Engineering" (1997), Gyeomjisa
- C. J. M. Lasance, "Electronics Cooling", ~ (2005)
- Scigiene Corporation, "IR Thermometers & Emissivity", 1~ (2005)
- C. C. Lia, , Mater. Lett, 58, pp.3903~ (2004)
- Ewa Rudnik, , Surf. Coat. Technol., pp.SCT-18573~ (2013)
- American Society for Testing and Materials, "D5470 : Standard Test Method for Thermal Transmission Properties of Thermally Conductive Electrical Insulation Materials", ~
- David. R. Gaskell, "Introduction to Transport Phenomena in Materials Engineering" (2000), Prentice Hall
- E 672, "Introduction to Spectroscopy, 3", pp.2008, Pavia, Donald L. Brooks
- M. R. Johan, , Int. J. Electrochem. Sci, 6, pp.6094~ (2011)
- Danilo C. Pereira, , J. Braz. Chem. Soc, 17(8), pp.1651~ (2006)
- B. Shokri, , Proceedings of 19th International Symposium on Plasma Chemistry Society (2009)
- Markova-Deneva, , Journal of the University of Chemical Technology and Metallurgy, 45(4), pp.351~ (2010)