계면 화학반응과 무전해 니켈 금속층에서 나타나는 취성파괴와의 연관성에 관한 연구
Correlation between Interfacial Reaction and Brittle Fracture Found in Electroless Ni(P) Metallization
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무전해 Ni(P)과 솔더와의 반응 중 발견되는 취성파괴 현상과 계면 화학반응시의 금속간화합물 spalling과의 연관성을 전단 파괴실험을 통하여 체계적으로 연구하였다. 취성파괴는 무전해 Ni(P)과 Sn-3.5Ag 솔더와의 반응 후에만 나타났고 Sn-3.0Ag-0.5Cu 솔더와의 반응시에는 연성파괴만이 관찰되었다. Sn-3.0Ag-0.5Cu 솔더와의 반응시 (Ni,Cu)3Sn4와 (Cu,Ni)6Sn5의 삼성분계 금속간화합물이 생성되었고 spalling은 발생하지 않았다. 반면, Sn-3.5Ag 솔더와의 반응시에는 Ni3Sn4 금속간화합물이 spalling된 솔더패드에서 취성파괴가 발생하였다. 파괴표면을 면밀히 분석한 결과 취성파괴는 Ni3Sn4 금속간화합물과 Ni(P) 금속층 사이에 형성된 Ni3SnP 층에서 발생하는 것을 알 수 있었다. Ni3SnP 금속간화합물 층은 Ni3Sn4 금속간화합물이 spalling되는 과정 중에 두껍게 성장하므로 무전해 Ni(P) 사용시 기계적 신뢰성을 보장하기 위해서는 금속간화합물의 spalling을 방지하는 것이 매우 중요하다.
Abstract
:A systematic investigation of shear testing was conducted to find a relationship between Ni-Sn intermetallic spalling and the brittle fracture observed in electroless Ni(P)/solder interconnection. Brittle fracture was found in the solder joints made of Sn-3.5Ag, while only ductile fracture was observed in a Cu-containing solder (Sn-3.0Ag-0.5Cu). For Sn-3.0Ag-0.5Cu joints, (Ni,Cu)3Sn4 and/or (Cu,Ni)6Sn5 compound were formed at the interface without spalling from the Ni(P) film. For Sn-3.5Ag, Ni3Sn4 compound was formed and brittle fracture occurred in solder pads where Ni3Sn4 had spalled. From the analysis of fractured surfaces, it was found that the brittle fracture occurs through the Ni3SnP layer formed between Ni3Sn4 intermetallic layer and the Ni(P) film. Since the Ni3SnP layer is getting thicker during/after Ni3Sn4 spalling, suppression of Ni3Sn4 spalling is crucial to ensure the reliability of Ni(P)/solder system.
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