전기도금법으로 제조한 Ni 박막의 전기비저항 및 솔더 반응성
Electrical Resistivity and Solder-Reaction Characteristics of Ni Films Fabricated by Electroplating
2
조회
0
다운로드
5
인용
0
참고문헌
초록
도금전류밀도에 따른 Ni 박막의 결정립 크기, 전기비저항, 솔더 wetting angle 및 금속간화합물의 성장속도를 분석하였다. 도금전류밀도를 5 mA/cm2에서 40 mA/cm2로 증가시킴에 따라 Ni 박막의 표면 nodule의 크기가 감소하고 결정립이 미세화 되었으며, 전기비저항이 7.37 μΩ-cm에서 9.13 μΩ-cm로 증가하였다. 5 mA/cm2 및 10 mA/cm2에서 도금한 Ni 박막이 40 mA/cm2에서 형성한 Ni 박막에 비해 전기비저항이 낮고 dense 하며 계면 금속간화합물의 성장속도가 느리기 때문에 무연솔더의 UBM 용도로 더 적합할 것이다.
Abstract
: Characteristics of electroplated Ni films such as grain size, resistivity, solder wetting angle, and growth rate of intermetallic compound were evaluated as a function of electroplating current density. With increasing the electroplating current density from 5 mA/cm to 40 mA/cm, the nodule size on the Ni film surface decreased, grain refinement occurred, and resistivity increased from 7.37-cm to 9.13 -cm. Compared with Ni film processed at 40 mA/cm, Ni films electroplated at 5 mA/cm and 10 mA/cm exhibited low resistivity, dense microstructure, and slow growth rate of intermetallic compound. Ni films electroplated at 5 mA/cm and 10 mA/cm are more suitable for Ni UBM application than that fabricated at 40 mA/cm.
참고문헌 (16)
- "Plating and surface treatment", pp.~162 (1992)
- "Investigation of electroplating Ni UBM for Pb-free solders" (1992)
- "Interfacial reaction studies on lead" (2001)
- "Correlation between interfacial reaction and brittle fracture found in electroless Ni", pp.41~46 (2005)
- "Morphology of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization", 88, pp.6359~ (2000)
- "Spalling of intermetallic compounds during reaction between lead-free solders and electroless Ni-P metallization", 19, pp.2428~ (2004)
- "Electrodeposition of composites an expanding subject in electrochemical materials science", 45, pp.3397~3402 (2000)
- "Electro-deposition of particle-strengthened nickel films", a234-235, pp.474~476 (1997)
- "Electrodeposited Co-Ni-Al2O3 composite coatings", 176, pp.157~164 (2004)
- "Kinetics of particle codeposition of nanocomposites", 149 (2002)
- "Elements of X-ray diffraction" (1978)
- "Study on failure mode of solder bump fabricated using eutectic solder electroplating process", 18-26 (2000)
- "Effects of current density and deposition time on electrical resistivity of electroplated Cu layers", 15, pp.757~762 (2004)
- "Galvanostatic electrodeposition and microstructure of copper oxide film", 2, pp.22~27 (1998)
- "Manufacturing of Cu", electroless nickel, pp.1999, 22[DOI]
- "Surface properties and solderability behaviour of nickel-phosphorous and nickel-boron deposited by electroless plating", 31, pp.321~327 (2001)