전류밀도에 따른 SnAg 도금층의 특성 및 Cu 필라 솔더 범프의 단면 미세구조 측정
Characterization of the SnAg Electrodeposits according to the Current Density and Cross-sectional Microstructure Analysis in the Cu Pillar Solder Bump
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We investigated the surface morphology and the change of Ag concentration for SnAg electrodeposits according to the current density using labmade and commercial plating solutions. The concentration of Ag in the SnAg electrodeposits decreased with increasing the current density. The Ag concentrations at the conditions of over 50 mA/cm2 were below 3 wt% and the surface was relatively smooth. Cu pillar bump was fabricated by using SnAg electroplating, and it was reflowed at 240oC for 90 sec. The cross-sectional microstructure was investigated by using EBSD measurement and it was found that the grain size of SnAg became smaller by increasing the number of reflow treatments.
Abstract
We investigated the surface morphology and the change of Ag concentration for SnAg electrodeposits according to the current density using labmade and commercial plating solutions. The concentration of Ag in the SnAg electrodeposits decreased with increasing the current density. The Ag concentrations at the conditions of over 50 mA/cm2 were below 3 wt% and the surface was relatively smooth. Cu pillar bump was fabricated by using SnAg electroplating, and it was reflowed at 240oC for 90 sec. The cross-sectional microstructure was investigated by using EBSD measurement and it was found that the grain size of SnAg became smaller by increasing the number of reflow treatments.
참고문헌 (11)
- M. Schlesinger, "Modern Electroplating" (2010), John Wiley & Sons Inc
- K.-N. Tu, "Solder Joint Technology: Materials, Properties, and Reliability" (2007), Springer
- K. Zeng, , Mat. Sci. and Eng. R, 38, pp.55~ (2002)
- S. -W. Chen, , J. Mater Sci : Matter. Electron, 18, pp.19~ (2007)
- M. Fukuda, , J. of the Electrochem. Soc, 149, pp.C244~ (2002)
- T. B. Richardson, "US patent 7,713,859 B2", ~
- K. Tsuji, "US patent 7,938,948 B2", ~
- J. Y. Kim, , J. of Electronic Materials, 33, pp.1459~ (2004)
- Y.-D. Tsai, , J. of the Electrochem. Soc, 158, pp.D527~ (2011)
- 김상혁, "Cu 필라 솔더 범프의 리플로우 전후 형상변화 및 모델링", 대한금속·재료학회지, 53(7), pp.495~499 (2015), 대한금속·재료학회[DOI]
- Y. Wang, , J. Im and P. S. Ho; J. Mater. Res, 27, pp.1131~ (2012)