금속 Ni 분말을 용해하여 제조된 용액에서 Ni 농도 변화가 전기도금 된 Ni 필름 특성에 미치는 영향
Influence of Change of Ni Concentration in Baths Fabricated by Dissolving Metal Ni Powders on Properties of Electrodeposited Ni Film
2
조회
0
다운로드
2
인용
0
참고문헌
키워드
초록
Chloride baths for electrodeposited Ni thin films were fabricated by dissolving metal Ni powders with the mixed solution consisting of HCl and de-ionized water. Current efficiency, residual stress, surface morphology and microstructure of Ni films with the change of metal ion (Ni2+) concentrations in the plating solution were studied. Current efficiency was measured to be more than 90% with increasing Ni2+ concentrations in the plating solution. Residual stress of Ni thin film was increased from about 400 to 780 MPa with increasing Ni2+ concentration from 0.2 to 0.5 M. It is gradually decreased to 650 MPa at 0.9 M Ni2+ concentration. Smooth surface morphologies were observed over 0.3 M Ni2+ concentration, but nodule surface morphology at 0.2 M. Ni films consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks in XRD patterns. Preferred orientation of FCC(111) was observed and its intensity was slightly decreased with increasing Ni2+ concentration. The average grain size was slightly increased at 0.3 M Ni2+ concentration and then slightly decreased with increasing Ni2+ concentration.
Abstract
Chloride baths for electrodeposited Ni thin films were fabricated by dissolving metal Ni powders with the mixed solution consisting of HCl and de-ionized water. Current efficiency, residual stress, surface morphology and microstructure of Ni films with the change of metal ion (Ni2+) concentrations in the plating solution were studied. Current efficiency was measured to be more than 90% with increasing Ni2+ concentrations in the plating solution. Residual stress of Ni thin film was increased from about 400 to 780 MPa with increasing Ni2+ concentration from 0.2 to 0.5 M. It is gradually decreased to 650 MPa at 0.9 M Ni2+ concentration. Smooth surface morphologies were observed over 0.3 M Ni2+ concentration, but nodule surface morphology at 0.2 M. Ni films consist of FCC(111), FCC(200), FCC(220) and FCC(311) peaks in XRD patterns. Preferred orientation of FCC(111) was observed and its intensity was slightly decreased with increasing Ni2+ concentration. The average grain size was slightly increased at 0.3 M Ni2+ concentration and then slightly decreased with increasing Ni2+ concentration.
참고문헌 (14)
- M. Petec, "Plating Nickel-63 on Copper Coupons", Chemical Technology Division, ~ (1989)
- S.D. Cooper, "Surrogate standards for the determination of individual polychlorinated biphenyls using highresolution gas chromatography with electron capture detection", Anal. Chem, 57(13), pp.2469~2473 (1985)
- M. Kumar, "An electrochemical method for the preparation of 63Ni source for the calibration of thermoluminescence dosimeter (TLD)", Appl. Rad. Isot, 67, pp.1042~1049 (2009)
- J.L. Steeb, "Nickel-63 Microirradiators and Applications", Ph.D., pp.2010
- 박근용, "금속분말 Ni을 용해 한 Chloride Bath로 도금된 니켈후막의 입자크기에 대한 전류밀도 영향", 한국자기학회지, 23(1), pp.12~17 (2013), 한국자기학회
- 윤필근, "금속 Ni 분말을 용해한 도금용액으로부터 전기도금 된 Ni 박막 특성에 미치는 도금조건의 영향", 한국표면공학회지, 48(3), pp.73~81 (2015), 한국표면공학회[DOI]
- 윤필근, "63Ni 밀봉선원용 Ni 전기도금 박막에서 Ni 농도가 잔류응력에 미치는 영향", 한국표면공학회지, 50(1), pp.29~34 (2017), 한국표면공학회[DOI]
- D.-Y. Park, "Electrodeposited Ni1-xCox nanocrystalline thin films:structure-property relationships", J. Electrochem. Soc, 153(12), pp.C814~C821 (2006)
- J.W. Dini, "Electrodeposition-The Materials Science of Coatings and Substrates", pp.331~ (1993), Noyes Publ
- B.-Z. Lee, "Spontaneous growth mechanism of tin whiskers", Acta Mater, 46, pp.3701~3714 (1998)
- K.-N. Tu, "Electronic Thin Film Science for Electrical Engineers and Materials Scientists" (1992), Macmillan Publishing Company
- 박덕용, "Chloride Bath로부터 전기도금된 나노결정립 니켈 박막의 잔류응력 변화에 대한 연구", 전기화학회지, 14(3), pp.163~170 (2011), 한국전기화학회
- G. A. Di Bari, "Modern Electroplating", pp.139~199 (2000), Wiley-Interscience
- D.-Y. Park, "Stress changes of nanocrystalline CoNi thin films electrodeposited from chloride baths", Electrochem. Solid-State Lett, 8(2), pp.C23~C25 (2005)