금속 Ni 분말을 용해한 도금용액으로부터 전기도금 된 Ni 박막 특성에 미치는 도금조건의 영향
Effects of Electrodeposition Conditions on Properties of Ni Thin Films Electrodeposited from Baths Fabricated by Dissolving Metal Ni Powders
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Chloride plating solution was fabricated by dissolving metal Ni powders in solution with HCl and deionized water. Effects of deposition conditions on the properties of Ni films electrodeposited from chloride baths were studied. Current efficiency of Ni films electrodeposited from the baths containing saccharin was decreased with increasing the current density. Residual stress of Ni thin films ware measured to be about 230 ~ 435 MPa in the range of current density of 10 ~ 25 mA/cm2. Cathode current efficiency in baths without saccharin was initially increased with increasing pH, while it was decreased with increasing pH further. Cathode current efficiency in baths with saccharin (except at pH 2) exhibited less 10 ~ 20% than that in baths without saccharin. Residual stress of Ni films electrodeposited from baths without saccharin was measured to be 388 ~ 473 MPa in the range of pH 2 ~ pH 5 and then was increased to 551 MPa at pH 6. On the other hand, residual stress of Ni films electrodeposited from baths with saccharin was increased with increasing pH. Surface morphology was strongly affected by the change of current density, but slightly by solution pH and addition of saccharin.
Abstract
Chloride plating solution was fabricated by dissolving metal Ni powders in solution with HCl and deionized water. Effects of deposition conditions on the properties of Ni films electrodeposited from chloride baths were studied. Current efficiency of Ni films electrodeposited from the baths containing saccharin was decreased with increasing the current density. Residual stress of Ni thin films ware measured to be about 230 ~ 435 MPa in the range of current density of 10 ~ 25 mA/cm2. Cathode current efficiency in baths without saccharin was initially increased with increasing pH, while it was decreased with increasing pH further. Cathode current efficiency in baths with saccharin (except at pH 2) exhibited less 10 ~ 20% than that in baths without saccharin. Residual stress of Ni films electrodeposited from baths without saccharin was measured to be 388 ~ 473 MPa in the range of pH 2 ~ pH 5 and then was increased to 551 MPa at pH 6. On the other hand, residual stress of Ni films electrodeposited from baths with saccharin was increased with increasing pH. Surface morphology was strongly affected by the change of current density, but slightly by solution pH and addition of saccharin.
참고문헌 (19)
- M. Petec, "Plating Nickel-63on Copper Coupons" (1989), Chemical Technology Division
- S. D. Cooper, , Anal. Chem, 57(13), pp.2469~ (1985)
- M. Kumar, , Appl. Rad. Isot, 67, pp.1042~ (2009)
- J. L. Steeb, "Nickel-63 Microirradiators and Applications", Ph.D, pp.2010
- J. W. Judy, , J. Microelectromech. Syst, 4, pp.162~ (1995)
- J. W. Judy, , J. Microelectromech. Syst, 6, pp.249~ (1997)
- 박덕용, "Chloride Bath로부터 전기도금된 나노결정립 니켈 박막의 잔류응력 변화에 대한 연구", 전기화학회지, 14(3), pp.163~170 (2011), 한국전기화학회
- 박근용, "금속분말 Ni을 용해 한 Chloride Bath로 도금된 니켈후막의 입자크기에 대한 전류밀도 영향", 한국자기학회지, 23(1), pp.12~17 (2013), 한국자기학회
- D. -Y. Park, , J. Electrochem. Soc, 153(12), pp.C814~ (2006)
- J. W. Dini, "Electrodeposition-The Materials Science of Coatings and Substrates", pp.339~ (1993), Noyes Publ. Park Ridge
- B. -Z. Lee, , Acta Mater, 46, pp.3701~ (1998)
- K. -N. Tu, "Electronic Thin Film Science for Electrical Engineers and Materials Scientists" (1992), Macmillan Publishing Company
- G. A. Di Bari, "Modern Electroplating", pp.139~199 (2000), Wiley-Interscience
- R. Weil, , Plating, 58, pp.50~ (1971)
- I. Kim, , Electrochim. Acta, 52, pp.1805~ (2006)
- P. Zentner, , Jennings, Plating, 39(865), pp.1229~ (1952)
- D. Kim, , Electrochim. Acta, 48, pp.819~ (2003)
- 18)P. C. Crouch, , Institute of Metal Finishing, 61, pp.133~ (1983)
- D. -Y. Park, , Electrochem. Solid-State Lett, 8(2), pp.C23~C25 (2005)