Flexible DDI Package의 Bonding 기술 발전
Advancements in Bonding Technologies for Flexible Display Driver IC(DDI) Packaging
0
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
본 논문은 전자 기기의 소형화와 유연성을 실현하기 위한 플렉시블 패키징 핵심 기술 중 하나인 Chip On Film(COF) 기술에 대해 논의합니다. COF는 Display Driver IC(DDI)를 유연한 폴리이미드(Polyimide) 기판에 직접 부착하여, 고해상도 디스플레이의 경량화와 두께 감소를 가능하게 합니다. COF 기술은 주로 Organic Light Emitting Diode(OLED) 디스플레이와 같은 고성능 디스플레이 패널에서 사용되며, 스마트폰과 웨어러블 기기와 같은 휴대용 전자장치에서 핵심적인 역할을 합니다. 본 연구에서는 COF의 주요 구성 요소 및 본딩 기술의 발전을 분석합니다. 특히, 열압착(Thermo-Compression Bonding), 초음파 본딩(Thermo-sonic Bonding)과 같은 최신 본딩 기법의 도입으로, 본딩 신뢰성및 전기적 성능이 크게 향상되었습니다. 이러한 본딩 기술은 미세 피치 구조에서 높은 전기적 연결성을 유지하면서도, COF 패키지의 기계적 안정성을 강화합니다. 또한, COF 본딩 기술의 향후 발전 방향과 그에 따른 도전 과제를 논의하며, 차세대 디스플레이 및 Advanced 패키징 기술로서의 가능성을 조망합니다.
Abstract
This paper discusses Chip On Film (COF) technology, one of the key technologies in flexible packaging to enable miniaturization and flexibility of electronic devices. COF attaches Display Driver IC (DDI) directly to a flexible polyimide substrate, enabling lightweight and reduced thickness for high-resolution displays. COF technology is primarily used in high-performance display panels, such as organic light emitting diode (OLED) displays, and plays a key role in portable electronic devices, such as smartphones and wearable devices. This study analyzes the key components of COF and advances in bonding technology. In particular, the introduction of modern bonding techniques, such as thermocompression bonding and thermo-sonic bonding, has led to significant improvements in bonding reliability and electrical performance. These bonding techniques enhance the mechanical stability of COF packages while maintaining high electrical connectivity in fine-pitch structures. This paper will discuss the future development of COF bonding technology and its challenges and explore its potential as a next-generation display and advanced packaging technology.
참고문헌 (29)
- C. -I. Chen, "Bondability Study of Chip-on-Film (COF) Inner Lead Bonding (ILB) Using Conventional Gang Bonder", IEEE Transactions on Electronics Packaging Manufacturing, 31(4), pp.285~290 (2008)
- K. -M. Harr, "Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive", Microelectronics Reliability, 55(8), pp.1241~1247 (2015)
- S. -C. Kim, "Low temperature chip on film bonding technology for 20 μm pitch applications", Journal of Materials Science : Materials in Electronics, 27, pp.3658~3667 (2015)
- D. -S. Liu, "Optimization of Bonding Force, Sinking Value, and Potting Gap Size in COF Inner Lead Bonding Process", IEEE Transactions on Advanced Packaging, 32(3), pp.593~601 (2009)
- A. Roshanghias, "Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates", Microelectronic Engineering, 228 (2020)
- B. -R. Lee, "Effect of Solder Structure on the In-situ Intermetallic Compounds growth Characteristics of Cu", Sn-3. 5Ag Microbump, 2013, pp.20(3), 45~51
- J. H. Lau, "Recent Advances and Trends in Advanced Packaging", IEEE Transactions on Components, Packaging and Manufacturing Technology, 12(7), pp.228~252 (2022)
- M. J. Yim, "Recent advances on anisotropic conductive adhesives(ACAs)for flat panel displays and semiconductor packaging applications", International Journal of Adhesion and Adhesives, 26(5), pp.304~313 (2006)
- C. -K. Chung, "A Study on the Assembly Process and Reliability of COF(Chip-On-Flex)Using ACFs(Anisotropic Conductive Films)for CCM(Compact Camera Module)", J. Microelectron. Packag. Soc, 15(2), pp.7~15 (2008)
- S. -Y. Jung, "A Study on the Flexible Chipon-Fabric (COF) Assembly using Anisotropic Conductive Films (ACFs) Materials", Proc. 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), pp.283~288 (2019)
- J. -H. Kim, "Bending Properties of Anisotropic Conductive Films Assembled Chip-in-Flex Packages for Wearable Electronics Applications", IEEE Transactions on Components, Packaging and Manufacturing Technology, 6(2), pp.208~215 (2016)
- S. Zhang, "A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0. 5Cu-Based Flex-on-Board Application at a 250 °C Bonding Temperature", IEEE Transactions on Components, Packaging and Manufacturing Technology, 8(3), pp.383~391 (2018)
- J. -W. Kim, "Analysis of Failure Mechanism in Anisotropic Conductive and Non-Conductive Film Interconnections", IEEE Transactions on Components and Packaging Technologies, 31(1), pp.65~73 (2008)
- S. Lee, "The Effect of the Thermal Mechanical Properties of Nonconductive Films on the Thermal Cycle Reliability of 40-μm Fine Pitch Cu-Pillar", Ni, IEEE Transactions on Components, Packaging and Manufacturing Technology, pp.2019, 9(1)[DOI]
- Y. Cheung, "Solder Joint Integrity of TC-NCP Thermo-compression Bonding Process", Proc. 2012 IEEE The 14th International Conference on Electronic Materials and Packaging (EMAP) (2012)
- H. -Y. Kim, "Reliability of an ultra-fine-pitch COF flip-chip package using non-conductive paste", Electronic Materials Letters, 12, pp.48~53 (2016)
- T. Nonaka, "Low temperature touch down and suppressing filler trapping bonding process with a wafer level pre-applied underfilling film adhesive", Proc. 2012 IEEE 62nd Electronic Components and Technology Conference, pp.444~449 (2012)
- S. Tan, "Process optimization to overcome void formation in nonconductive paste interconnections for fine-pitch applications", Journal of electronic materials, 34, pp.1143~1149 (2005)
- J. S. Lee, "Nanoscale-Dewetting-Based Direct Interconnection of Microelectronics for a Deterministic Assembly of Transfer Printing", Adv Mater, 32(21), pp.1908422~ (2020)
- Y. C. Lin, "A review of the influencing factors on anisotropic conductive adhesives joining technology in electrical applications", Journal of Materials Science, 43(9), pp.3072~3093 (2008)
- S. -T. Lu, "A novel compliant-bump structure for ACA-bonded chip-on-flex (COF) interconnects with ultra-fine pitch", Proc. 2009 59th Electronic Components and Technology Conference, pp.1544~1551 (2009)
- S. -C. Kim, "Review paper : Flip chip bonding with anisotropic conductive film(ACF)and nonconductive adhesive(NCA)", Current Applied Physics, 13, pp.S14~S25 (2013)
- Y. C. Chan, "Electrical Characterization of NCP-and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages", IEEE Transactions on Advanced Packaging, 30(1), pp.142~147 (2007)
- J. -Y. Ryu, "Automatic Defect Detection System for Ultra Fine Pattern Chip-on-Film", Proc. Proceedings of the Korean Institute of Information and Communication Sciences Conference, pp.775~778 (2010), The Korea Institute of Information and Communication Engineering
- C. -T. Hsieh, "Adhesion and Evaluation of Thermoplastic Nonconductive Film Materials in Flip Chip for Fine-Pitch Chip-on-Flex", IEEE Transactions on Components, Packaging and Manufacturing Technology, 1(7), pp.984~990 (2011)
- J. -Y. Juang, "The development of high through-put micro-bump-bonded process with non-conductive paste (NCP)", Proc. 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), pp.114~118 (2012)
- K. -L. Suk, "Studies on various chip-on-film(COF)packages using ultra fine pitch two-metal layer flexible printed circuits(two-metal layer FPCs)", Microelectronics Reliability, 52(6), pp.1182~1188 (2012)
- K. E. Aasmundtveit, "Solid-Liquid Interdiffusion (SLID)bonding—Intermetallic bonding for high temperature applications", Proc. 2013 Eurpoean Microelectronics Packaging Conference (EMPC), pp.1~6 (2013)
- J. -W. Yoon, "Flip-chip Bonding Technology and Reliability of Electronic Packaging", Journal of Welding and Joining, 25(2), pp.6~15 (2007)