COF 리드 배열 집적도 향상을 위한 비선형 구조해석
A Nonlinear Structural Analysis for Improvement of lead density in COF Bonding
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초록
In recent years, technology has been developed the way the volume of the portable communicationdevice is reduced but its performance is maintained. The COF(Chip On Film) packaging method is useddue to the densification of the lead pitch, especially for the display driver IC. During COF packaging,lead break and film detachment could occur by the high bonding temperature and pressure, andpossibility for lead interference can emerge by deformation of leads. In this study, a new double-column arrangement of leads is considered to increase lead densityfurther than the existing zigzag arrangement of leads, and nonlinear structural analysis was carried out toexamine whether the interference can occur. The results showed that stress and deformation of the corner region appear relatively higher thanthose of central region, and interference did not occur by the lead strain for the double-columnarrangement of leads with pitch of 25μm. Therefore, double-column lead arrangement can improve leaddensity by about 176% compared to the zigzag lead arrangement.
Abstract
In recent years, technology has been developed the way the volume of the portable communicationdevice is reduced but its performance is maintained. The COF(Chip On Film) packaging method is useddue to the densification of the lead pitch, especially for the display driver IC. During COF packaging,lead break and film detachment could occur by the high bonding temperature and pressure, andpossibility for lead interference can emerge by deformation of leads. In this study, a new double-column arrangement of leads is considered to increase lead densityfurther than the existing zigzag arrangement of leads, and nonlinear structural analysis was carried out toexamine whether the interference can occur. The results showed that stress and deformation of the corner region appear relatively higher thanthose of central region, and interference did not occur by the lead strain for the double-columnarrangement of leads with pitch of 25μm. Therefore, double-column lead arrangement can improve leaddensity by about 176% compared to the zigzag lead arrangement.
참고문헌 (8)
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