Advanced Package용 Molded Bridge Die on Substrate(MBoS) 공정 기술 연구
Research on Process Technology of Molded Bridge Die on Substrate (MBoS) for Advanced Package
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초록
Artificial Intelligence(AI) 기술이 발전함에 따라 데이터 센터 분야 등에서 고사양 반도체에 대한 수요가 증가하고 있다. 이러한 추세에 맞춰 반도체 성능을 향상하기 위해 회로의 미세화 및 I/O의 고밀도화가 요구되고 있으며 이를충족할 수 있는 기술로 차세대 packaging인 2.5dimension(D) packaging이 주목받고 있다. 2.5D packaging에 활용되는 요소 기술로는 microbump, interposer 및bridge die가 있다. 이러한 기술을 적용하면 기존 방식 대비 더 많은 수의 I/O 구현이 가능하여 동시에 다량의 정보를 송수신할 수 있으며, 전기 신호를 전달하는 배선 길이를 단축하여 전력 소모량을 감소시킬 수 있다. 본 논문에서는 molding 공정 및 RDL공정을 융합하여 제작한 Molded Bridge die on Substrate(MBoS) 공정 기술을 제안한다. 제안된 MBoS 기술은 적용이 쉽고 활용 분야가 넓어 차세대 패키징 기술의 대중화에 기여할 것으로 예상된다.
Abstract
With advances of artificial intelligence (AI) technology, the demand is increasing for high-end semiconductors in various places such as data centers. In order to improve the performance of semiconductors, reducing the pitch of patterns and increasing density of I/Os are required. For this issue, 2.5dimension(D) packaging is gaining attention as a promising solution. The core technologies used in 2.5D packaging include microbump, interposer, and bridge die. These technologies enable the implementation of a larger number of I/Os than conventional methods, enabling a large amount of information to be transmitted and received simultaneously. This paper proposes the Molded Bridge die on Substrate (MBoS) process technology, which combines molding and Redistribution Layer (RDL) processes. The proposed MBoS technology is expected to contribute to the popularization of next-generation packaging technology due to its easy adaption and wide application areas.
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