저온 Cu 하이브리드 본딩을 위한 폴리머 본딩
The Polymer Bonding for Low-temperature Cu Hybrid Bonding
0
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
본 논문은 반도체 패키징 기술의 발전에서 Cu/Polymer 하이브리드 본딩 기술의 중요성을 다룬다. 인공지능(AI) 시대의 요구에 부응하여, 반도체 업계는 높은 I/O 수, 저전력, 고열 방출, 다기능성, 소형화를 달성하기 위해 이종 집적 패키징 기술을 탐구하고 있다. 기존의 Cu/SiO2 하이브리드 구조는 1nm 이하의 표면거칠기 달성을 위한 CMP 공정과의 호환성 및 파티클 원인의 접합부 결함 발생 등의 한계점이 존재하지만, Polymer를 사용한 Cu/Polymer 하이브리드 본딩 기술이 이를 극복할 수 있는 대안으로 주목받고 있다. 본 연구는 Cu/Polymer 하이브리드 본딩에 필요한 Polymer의 증착, 패터닝, 그리고 물성 변화를 중점적으로 탐구하며, 이를 통해 Cu/Polymer 하이브리드 본딩 구조가 기존 기술 대비 갖는 장점과 잠재적 응용 가능성을 제시한다. 특히, 낮은 유리전이온도(Tg)를 가진 Polymer의 사용이 가질 수 있는 저온 접합 공정에서의 이점과 높은 열팽창계수로 인한 기계적 특성의 향상에 대해 논의된다. 또한, Polymer의 표면 특성 변화와플라즈마 처리를 통한 접합 메커니즘의 개선을 다루며, 본 연구는 Cu/Polymer 하이브리드 본딩 기술이 반도체 업계의 고성능, 저전력 소자 개발에 기여할 수 있는 중요한 돌파구가 될 것임을 강조한다.
Abstract
This paper addresses the significance of Cu/Polymer Hybrid Bonding technology in the advancement of semiconductor packaging. As the demands of the AI era increase, the semiconductor industry is exploring heterogeneous integration packaging technologies to achieve high I/O counts, low power consumption, efficient heat dissipation, multifunctionality, and miniaturization. The conventional Cu/SiO2 Hybrid Bonding structure faces limitations such as achieving compatibility with CMP processes to attain surface roughness below 1nm and the occurrence of bonding defects due to particles. However, Cu/Polymer Hybrid Bonding technology, utilizing polymers, is gaining attention as a promising alternative to overcome these challenges. This study focuses on the deposition, patterning, and material properties of polymers essential for Cu/Polymer Hybrid Bonding, highlighting the advantages and potential applications of this technology compared to existing methods. Specifically, the use of polymers with low glass transition temperatures (Tg) is discussed for their benefits in low-temperature bonding processes and improved mechanical properties due to their high coefficients of thermal expansion. Furthermore, the study explores surface property modifications of polymers and the enhancement of bonding mechanisms through plasma treatment. This research emphasizes that Cu/Polymer Hybrid Bonding technology can serve as a critical breakthrough in developing high-performance, low-power semiconductor devices within the industry.
참고문헌 (36)
- S. Wang, "Isothermal Aging and Electromigration Reliability of Cu Pillar Bumps Interconnections in Advanced Packages monitored by In-situ Dynamic Resistance Testing", Journal of Materials Research and Technology, 32, pp.937~954 (2024)
- C. L. Gan, "Interconnect Reliability in Advanced Memory Device Packaging", Journal of Adhesion Science and Technology, pp.1~3 (2024), Taylor & Francis
- F. Niu, "Low-temperature Cu", SiO2 hybrid bonding based on Ar, Applied Surface Science, pp.2024, 648[DOI]
- B. Lee, "High-Throughput Characterization of Nanoscale Topography for Hybrid Bonding by Optical Interferometry", 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), pp.969~975 (2024)
- H. Seo, "Cu-SiO2 Hybrid Bonding", Journal of the Microelectronics and Packaging Society, 27(1), pp.17~24 (2020)
- Y. -M. Lin, "A hybrid bonding interconnection with a novel low-temperature bonding polymer system", 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), pp.2128~2134 (2022)
- Y. Kim, "A Review on the Bonding Characteristics of SiCN for Low-temperature Cu Hybrid Bonding", Journal of the Microelectronics and Packaging Society, 30(4), pp.8~16 (2023)
- J. Park, "Advanced Cu", Polymer Hybrid Bonding System for Fine-Pitch 3D Stacking Devices, 2023, pp.8(20), ~
- C. Jeon, "Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition", ACS Applied Materials & Interfaces (2024)
- M. Lee, "Cu", SiO2 CMP Process for Wafer Level Cu Bonding, 2013, pp.20(2), 47~51
- Z. -J. Hu, "Cu CMP process development and characterization of Cu dishing with 1.8 μm Cu pad and 3.6μm pitch in Cu", SiO2 hybrid bonding, 2019, pp.58, ~
- V. Balan, "CMP process optimization for bonding applications", ICPT 2012 - International Conference on Planarization, 2012, 1~7
- O. -H. Lee, "Low-Temperature Nanocrystalline Cu", polymer Hybrid Bonding with Tailored CMP Process, 2024 (2024), 1863~1867
- P. -S. He, "Chemical mechanical planarization of nanotwinned copper", polyimide for low temperature hybrid bonding, 2024, pp.969, 118544~
- K. K. Gleason, "Designing organic and hybrid surfaces and devices with initiated chemical vapor deposition(iCVD)", Advanced Materials, 36(8), pp.2306665~ (2024)
- W. E. Tenhaeff, "Initiated and oxidative chemical vapor deposition of polymeric thin films : iCVD and oCVD", Adv. Funct. Mater, 18(7), pp.979~992 (2008)
- K. K. Gleason, "Nanoscale control by chemically vapourdeposited polymers", Nature Reviews Physics, 2(7), pp.347~364 (2020)
- C. Zavvou, "Poly(V3D3), an iCVD polymer with promising dielectric properties for high voltage capacitors", Solid-State Electron, 184, pp.108057~ (2021)
- V. Jousseaume, "Wafer Scale Insulation of High Aspect Ratio Through-Silicon Vias by iCVD", ACS Applied Materials & Interfaces, 16(24), pp.31624~31635 (2024)
- J. Kim, "Facilitating 3D Multichip Integration through Low-Temperature Polymer-to-Polymer Bonding", ACS Applied Electronic Materials, 6(5) (2024)
- C. -H. Lee, "Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Prebond for Cu", Polymer Hybrid Bonding, 2023, pp.13(8), 1316~1323
- H. Sakamoto, "Low-Temperature Polymer Hybrid Bonding with Nanoparticulated Cu and Photosensitive Acrylic Adhesive", 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), pp.871~875 (2024)
- Y. -H. Ting, "Surface Roughening of Polystyrene and Poly(methyl methacrylate)in Ar", O2 Plasma Etching, 2010, pp.2(4), 649~663
- H. Mischke, "Micromachining and Microfabrication Process Technology VIII, 4979", pp.372~381 (2003)
- N. Padhye, "A New Phenomenon : Sub-T(g), Solid-State, Plasticity-Induced Bonding in Polymers", Sci Rep, 7(1), pp.46405~ (2017)
- J. Simon, "Towards Tailored Dialdehyde Cellulose Derivatives: A Strategy for Tuning the Glass Transition Temperature", ChemSusChem, 17(5), pp.e202300791~ (2024)
- M. Kisiel, "The Effect of Nonterminal Liquid Crystalline Epoxy Resin Structure and Curing Agents on the Glass Transition of Polymer Networks", Polymers, 16(6), pp.857~ (2024)
- S. Yang, "Atomistic molecular dynamics simulation study on thermomechanical properties of poly(1, 3, 5-trimethyl-1, 3, 5-trivinyl cyclotrisiloxane)dielectric insulator for soft electronics", Journal of Mechanical Science and Technology, 32(5), pp.2183~2189 (2018)
- Y. Kayaba, "Demonstration of Low Temperature Cu-Cu Hybrid Bonding using A Novel Thin Polymer", 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), pp.606~613 (2024)
- M. S. Soh, "Influence of curing modes on crosslink density in polymer structures", Journal of dentistry, 32(4), pp.321~326 (2004)
- D. Abliz, "Curing methods for advanced polymer composites-a review", Polymers and Polymer Composites, 21(6), pp.341~348 (2013)
- P. Song, "High-performance polymeric materials through hydrogen-bond cross-linking", Advanced Materials, 32(18), pp.1901244~ (2020)
- S. K. Nemani, "Surface modification of polymers : methods and applications", Advanced Materials Interfaces, 5(24), pp.1801247~ (2018)
- H. Shinohara, "Studies on low-temperature direct bonding of VUV, VUV", O3 and O2 plasma pretreated cyclo-olefin polymer, 2011, pp.165(1), 124~131
- W. Du, "Temperature-mediated structural evolution of vapor–phase deposited cyclosiloxane polymer thin films for enhanced mechanical properties and thermal conductivity", Int. J. Extrem, 5(2), pp.025101~ (2023)
- D. D. Burkey, "Structure and mechanical properties of thin films deposited from 1, 3, 5-trimethyl-1, 3, 5-trivinylcyclotrisiloxane and water", J. Appl. Phys, 93(9), pp.5143~5150 (2003)