갈륨 및 갈륨 합금을 이용한 저온접합 기술 동향
Trends of Low-temperature Bonding Technologies using Gallium and Gallium Alloys
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초록
최근 세계적으로 유연 전자소자 관련 기술들이 주목을 받으면서 유연소자 제작 과정에서의 성형성 및 굽힘 상태에서의 성능과 내구성 등의 문제점을 개선하기 위하여 액체 금속을 사용한 배선·접합 기술들의 개발이 요구되고 있다. 이러한 요구에 부응하여 독성이 없으면서 낮은 점도와 우수한 전기전도도를 가지는 갈륨 및 갈륨계 합금 (공정 갈륨-인듐 및 공정 갈륨-인듐-주석 등)의 액체금속을 저온 접합소재로 이용하려는 다양한 연구들이 이루어지고 있다. 본 논문에서는 갈륨 및 갈륨계 합금을 이용한 저온접합 기술의 최신 연구동향을 정리하여 소개하고자 한다. 이러한 기술들은 향후 유연 전자소자의 제조 및 전자패키지에서의 저온접합 등의 분야에서 실용화를 위한 중요한 기반기술이 될 것으로 예상된다.
Abstract
Recently, as flexible electronic device-related technologies have received worldwide attention, the development of wiring and bonding technologies using liquid metals is required in order to improve problems such as formability in the manufacturing process of flexible devices and performance and durability in the bending state. In response to these needs, various studies are being conducted to use gallium and gallium-based alloys (eutectic Ga-In and eutectic Ga-In-Sn, etc.) liquid metals, with low viscosity and excellent electrical conductivity without toxicity, as lowtemperature bonding materials. In this paper, the latest research trends of low-temperature bonding technology using gallium and gallium-based alloys are summarized and introduced. These technologies are expected to become important base technologies for practical use in the fields of manufacturing flexible electronic devices and low-temperature bonding in microelectronic packages in the future.
참고문헌 (30)
- S. Liu, "Ga-Based Alloys in Microelectronic Interconnects: A Review", Materials (Basel), 11(8), pp.13~84 (2018)
- S. Liu, "Intermetallic formation mechanisms and properties in room-temperature Ga soldering", Journal of Alloys and Compounds, 826, pp.154221~ (2020)
- D. Zrnić, "On the resistivity and surface tension of the eutectic alloy of gallium and indium", Journal of The Less Common Metals, 18, pp.67~68 (1969)
- M. D. Dickey, "Eutectic gallium-indium (egain): A liquid metal alloy for the formation of stable struc-tures in microchannels at room temperature", Advanced Functional Materials, 18(7), pp.1097~1104 (2008)
- M. D. Dickey, "Emerging applications of liquid metals featuring surface oxides", ACS applied materials & interfaces, 6(21), pp.18369~18379 (2014)
- S. Liu, "Properties of CuGa2 Formed Between Liquid Ga and Cu Substrates at Room Temperature", J. Electron. Mater, 49, pp.128~139 (2020)
- Y. Cui, "Metallic Bond-Enabled Wetting Behavior at the Liquid Ga", CuGa2 Interfaces, 2018, pp.10, 9203~9210
- J. Tang, "Gallium-Based Liquid Metal Amalgams: Transitional-State Metallic Mixtures (TransM2ixes) with Enhanced and Tunable Electrical, Thermal, and Mechanical Properties", ACS Appl. Mater. Interfaces, 9(41), pp.35977~35987 (2017)
- S. Liu, "Effects of Ni and Cu Antisite Substitution on the Phase Stability of CuGa2 from Liquid Ga", Cu–Ni Interfacial Reaction, 2019, pp.11(35), 32523~32532
- D. Morales, "Liquid gallium and the eutectic gallium indium (EGaIn) alloy: Dielectric functions from 1.24 to 3.1 eV by electrochemical reduction of surface oxides", Appl. Phys. Lett, 109, pp.091905~ (2016)
- M. D. Dickey, "Eutectic Gallium-Indium (EGaIn): A Liquid Metal Alloy for the Formation of Stable Structures in Microchannels at Room Temperature", Adv.Funct. Mater, 18(7), pp.1097~1104 (2008)
- J. H. So, "Reversibly Deformable and Mechanically Tunable Fluidic Antennas", Adv. Funct. Mater, 19, pp.3632~3637 (2009)
- D. Zrnić, "On the resistivity and surface tension of the eutectic alloy of gallium and indium", Journal of The Less Common Metals, 18, pp.67~68 (1969)
- P. J. Geddis, "The Effect of Static Liquid Galinstan on Common Metals and Non-Metals at Temperatures up to 200°C", Canadian Journal of Chemistry, 98(12), pp.787~798 (2020)
- T. Liu, "Characterization of Nontoxic Liquid-Metal Alloy Galinstan for Applications in Microdevices", Journal of Microelectromechanical Systems, 21(2), pp.443~450 (2011)
- 윤태식, "TSV 기반 3차원 소자의 열적-기계적 신뢰성", 마이크로전자 및 패키징학회지, 24(1), pp.35~43 (2017), 한국마이크로전자및패키징학회
- M. Motoyoshi, "Through-Silicon Via (TSV)", Proc. IEEE, 97(1), pp.43~ (2009)
- S. K. Lin, "Interfacial Reactions in Cu", Ga and Cu, Cu Couples, pp.J. Electron. Mater, 2014[DOI]
- Shih-kang Lin, "Formation of Solid-Solution Cu-to-Cu Joints Using Ga Solder and Pt under Bump Metallurgy for Three-Dimensional Integrated Circuits", Electronic Materials Letters, 11(4), pp.687~694 (2015), 대한금속·재료학회
- J. Froemel, "Low Temperature Wafer Bonding Using Solid-Liquid Inter-Diffusion Mechanism", J. Microelectromech. Syst, 24, pp.1973~1980 (2015)
- D. Y. Lee, "Formation and Growth of Intermetallic Compounds during Reactions between Liquid Gallium and Solid Nickel", Materials, 14, pp.5694~ (2021)
- B. W. Kim, "Analysis of intermetallic compound formation in the reactions at liquid Ga", solid Pd interfac, 2022, pp.30, 101951~
- Ž. Marinković, "Comparative analysis of interdiffusion in some thin film metal couples at room temperature", Thin Solid Films, 217(1), pp.26~30 (1992)
- Hyeokgi Choi, "Interfacial reactions between liquid Ga and solid Au", Materials Letters, 330, pp.133220~, Elsevier BV[DOI]
- H. Kolb, "Evaluation of Detachable Ga-Based Solder Contacts for Thermoelectric Materials", J. Electron. Mater, 46, pp.5057~5063 (2017)
- S. Liu, "Interfacial reactions between Ga and Cu-xNi (x=0, 2, 6, 10, 14) substrates and the strength of CuxNi", Ga, Intermetallics, pp.2021, 133[DOI]
- J. B. Li, "A thermodynamic assessment of the copper-gallium system", Calphad, 32(2), pp.447~453 (2008)
- J. S. Wang, "First-principles calculations assisted thermodynamic assessment of the Pt–Ga–Ge ternary system", Calphad, 33, pp.561~569 (2009)
- S. Liu, "The Interaction of Sn-Ga Alloys and Au Coated Cu Substrates", Solid State Phenomena, 273, pp.3~8 (2018)
- M. W. M. Jones, "Simultaneous X-ray fluorescence and scanning X-ray diffraction microscopy at the Australian Synchrotron XFM beamline", J. Synchrotron Radiat, 23, pp.1151~1157 (2016)