무전해 니켈도금에 의한 도전성 실리콘고무 시트의 제조
Preparation of Conductive Silicone Rubber Sheets by Electroless Nickel Plating
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Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on flexible silicone rubber are described. The process has been performed using a conventional Ni(P) chemical bath. Additives and complexing agents such as ammonium chloride and glycine were added and the reaction pH was controlled by NaOH aqueous solution. Ni deposition rate and crystallinity have been found to vary with pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity, enhanced adhesion and optimum electric conductivity were formed uniformly on silicone rubber substrates under pH 7 at 70oC. The conductive Ni-plated silicone rubber showeda high electromagnetic interference shielding effect in the 400 MHz-1 GHz range.
Abstract
Electroless plating process as a solution deposition method is a viable means of preparing conductive metal films on non-conducting substrates through chemical reactions. In the present study, the preparation and properties of electroless Ni-plating on flexible silicone rubber are described. The process has been performed using a conventional Ni(P) chemical bath. Additives and complexing agents such as ammonium chloride and glycine were added and the reaction pH was controlled by NaOH aqueous solution. Ni deposition rate and crystallinity have been found to vary with pH and temperature of the plating bath. It was shown that Ni-films having the high crystallinity, enhanced adhesion and optimum electric conductivity were formed uniformly on silicone rubber substrates under pH 7 at 70oC. The conductive Ni-plated silicone rubber showeda high electromagnetic interference shielding effect in the 400 MHz-1 GHz range.
참고문헌 (15)
- J. H. Kim, "Selective Activation and Electroless Plating of Cu on a Polyimide Substrate by Using a Pre-Patterned Inhibitor Layer and Plasma Treatments", Journal of the Korean Physical Society, 52(2), pp.318~323 (2008), 한국물리학회
- N. C. Das, , Composites, 31A, pp.1069~ (2000)
- K. Sasikumar, , Bull. Mater. Sci, 29, pp.637~ (2006)
- Y. Yacubowicz, , Polymer Engin. Sci, 30, pp.459~ (1990)
- D. Li, , J. Mater. Sci, 43, pp.7121~ (2008)
- G. X. Wang, , Appl. Surf. Sci, 253, pp.480~ (2006)
- D. C. Weng, , J. Electrochem. Soc, 142(8), pp.2598~ (1995)
- Technical report, Roxtec multi-cable transit devices:Applications and design practices, , Roxtec, ~ (2014)
- S. Rosset, , Adv. Funct. Mater, 19, pp.470~ (2009)
- I. M. Graz, , Appl. Phys. Lett, 94, pp.071902~ (2009)
- S. P. Lacour, , Proc. IEEE, 93, pp.1459~ (2005)
- K. G. Keong, , J. Alloys Compd, 334, pp.192~ (2002)
- K. Hagiwara, , Plating &Surface Finishing, 84(4), pp.74~ (1997)
- I. Motizuki, , Trans. IMF, 77, pp.41~ (1999)
- "IEEE Standard Method for Measuring the Effectiveness of Electromagnetic Shielding Enclosure", IEEE Std. 299, ~ (1997)