비시안 무전해 Au 도금의 석출거동에 미치는 하지층 무전해 Ni-P 도금 조건의 영향
Effect of underlayer electroless Ni-P plating on deposition behavior of cyanide-free electroless Au plating
1
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.
Abstract
Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.
참고문헌 (28)
- W. J. Daukler, "A new operating regime for electroplating the gold absorber on x-ray masks", Microelectron. Eng, 23, pp.235~238 (1994)
- W. Chu, "Low-stress gold electroplating for X-ray masks", Microelectron. Eng, 17, pp.223~226 (1992)
- T. Osaka, "Development of new electrolytic and electroless gold plating processes for electronics applications", Sci. Technol. Adv. Mater, 7, pp.425~437 (2006)
- Y. Yoneda, "Packaging technology for imaging LSI", Fujitsu, 63, pp.489~495 (2012)
- Y. Ejiri, "Electroless Ni", Pd, J. Japan Inst. Electron. Packag, pp.2012, 15[DOI]
- I. Kato, "Influence of electroless Ni-P film condition on wire bondability", J. Surf. Finish. Soc. Jpn, 62(1), pp.47~53 (2011)
- J. Ushio, "Electronic device plated with gold by means of an electroless gold plating solution", European Patent Application EP 021789, ~ (1987)
- I. Takashi, "Development of a non-cyanide electroless gold plating bath", Surf. Finish. Soc. Jpn, 52, pp.410~ (2001)
- Y. Shindo, "Study of noncyanide electroless gold plating", Proceeding of the 84th Surface Finishing Society of Japan, pp.163~ (1991)
- Y. Sato, "Cyanide-free electroless gold plating from a bath containing disulfitoaurate and thiourea or its derivatives", Plat. Surf. Finish, 81, pp.74~ (1994)
- A. Sullivan, "The autocatalytic deposition of gold in nonalkaline, gold thiosulfate electroless bath", J. Electrochem. Soc, 142, pp.2250~ (1995)
- S. Dimitrijević, "Non-cyanide electrolytes for gold plating – A review", J. Electrochem. Sci, 8, pp.6620~6646 (2013)
- 한재호, "티오말산을 착화제로 하고 아미노에탄티올을 환원제로 하는 비시안계 무전해 Au 도금액의 석출 거동 및 도금 특성", 한국표면공학회지, 55(2), pp.102~119 (2022), 한국표면공학회
- 한재호, "캐피라리 전기 영동법에 의한 비시안 무전해 Au 도금액의 분석", 한국표면공학회지, 55(2), pp.120~132 (2022), 한국표면공학회
- 한재호, "A Newly Developed Non-Cyanide Electroless Gold Plating Method Using Thiomalic Acid as a Complexing Agent and 2-Aminoethanethiol as a Reducing Agent", CORROSION SCIENCE AND TECHNOLOGY, 21(2), pp.89~99 (2022), 한국부식방식학회[DOI]
- 김동현, "Comparison of Deposition Behavior and Properties of Cyanide-free Electroless Au Plating on Various Underlayer Electroless Ni-P films", 한국표면공학회지, 55(4), pp.202~214 (2022), 한국표면공학회
- K. Nishiyama, "The type and application of electroless gold plating", J. Surf. Finish. Soc. Jpn, 48, pp.393~ (1997)
- T. Yamamoto, "Effect of electroless nickel", displacement gold plating process on strength of solder Joint, 2003, pp.6, 339~344
- A. Chinda, "Gold plating thickness and soldering reliability of solder balls for electroless gold plated TAB tape carrier", J. Jpn. Inst. Electron. Packag, 3, pp.308~314 (2000)
- F. Taniguchi, "Thermal fatigue and mechanical reliability of FBGA solder joints", J. Jpn. Inst. Electron. Packag, 4, pp.56~62 (2001)
- H. Ohata, "The destruction mode and the life cycle times of the chip size package mounted on the circuit board by the bending test", J. Jpn. Inst. Electron. Packag, 4, pp.519~522 (2001)
- H. Matsuki, "A TEM observation of solder joints of an electronic device", J. Jpn, Inst. Metals, 64, pp.213~217 (2000)
- Y. Kariya, , 6th Symposium on Microjoining and Assembly Technology in Electronics, pp.415~ (2000)
- T. Sugizaki, "Effect of electroless nickel", immersion gold finishing on BGA solder joints, 2001, pp.4, 124~127
- Electroplating Research Society, "Environmental Coordinated Plating Technology", Daily Industrial Newspaper, 62~ (2006)
- 이호영, "ENIG 표면처리 공정 및 특성에 관한 연구", 한국표면공학회지, 40(1), pp.32~38 (2007), 한국표면공학회
- T. Laurila, "Combined thermodynamic-kinetic analysis of the interfacial reactions between Ni metallization and various lead-free solders", Materials, 2, pp.1796~1834 (2009)
- E. Bradley, "Effect of PCB finish on the reliability and wettability of ballgrid array packages", Proc. 45th Electronic Components and Technology Conference, pp.1028~1038 (1995)