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Fabrication of Highly Conductive Yarn using Electroless Nickel Plating

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Abstract― Highly conductive yarn was successfully obtained using electroless nickel plating method with palladium activation. In the presence of palladium seed on surface of fibers as a catalyst, continuos nickel layer produced on surface of fibers by reducing Ni2+ ion in the electroless plating bath to Ni0. It was found that the Pd-activation using SnCl2 and PdCl2 to deposit palladium seeds on the surface of fibers plays a key role in the subsequent electroless plating of nickel. It also found that electroless nickel plating on the fibers can induce the nickel-plated ELEXⓇ fibers to improve the electrical conductivity of the fibers. The thickness of nickel coating layer on the Pd-activated ELEXⓇ fibers and specific conductivity of the fiber were increased through electroless plating time. The temperature of nickel plating bath was very effective to enhance the nickel deposition rate.

Abstract

Abstract― Highly conductive yarn was successfully obtained using electroless nickel plating method with palladium activation. In the presence of palladium seed on surface of fibers as a catalyst, continuos nickel layer produced on surface of fibers by reducing Ni2+ ion in the electroless plating bath to Ni0. It was found that the Pd-activation using SnCl2 and PdCl2 to deposit palladium seeds on the surface of fibers plays a key role in the subsequent electroless plating of nickel. It also found that electroless nickel plating on the fibers can induce the nickel-plated ELEXⓇ fibers to improve the electrical conductivity of the fibers. The thickness of nickel coating layer on the Pd-activated ELEXⓇ fibers and specific conductivity of the fiber were increased through electroless plating time. The temperature of nickel plating bath was very effective to enhance the nickel deposition rate.

참고문헌 (10)

  1. E. A. Kim, "Effects of Catalyst Accelerator on Electromagnetic Shielding in Nonelectrolytic Cu-plated Fabrics", J. Appl. Physics, 87, pp.4984~4986 (2000)
  2. K. W. Oh, "Effect of Plasma Etching and PdCl2", SnCl2 Catalyzation on the Performance of Electroless Plated Copper Layer, 2003, pp.27, 843~850
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  4. M. Charbonnier, "Plasma Treatment Process for Palladium Chemisorption onto Polymers before Electroless Desorption", J. Electrochem. Soc., 143, pp.472~479 (1996)
  5. R. Sard, "The Nucleation, Growth, and Structure of Electroless Copper Deposits", J. Electrochem. Soc, 117, pp.864~870 (1970)
  6. S. Z. Chu, "Local Deposition of Ni-P Alloy on Aluminum by Laser Irradiation and Electroless Plating", J. Electrochem. Soc., 146, pp.537~546 (1999)
  7. M. J. DeSilva, "A Novel Seed Layer Scheme to Protect Catalytic Surfaces for Electroless Deposition", J. Electrochem. Soc, 143, pp.3512~3516 (1996)
  8. D. B. Lewis, "Investigation into the Structure of Electrodeposited nickel- Phosphorous Alloy Deposits", Surf. Coat. Technol, 78, pp.150~156 (1996)
  9. A. M. T. van der Putten, "Anisotropic Deposition of Electroless Nickel", J. Electrochem. Soc, 140, pp.2229~2235 (1993)

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