착화제와 pH가 무전해 Ni-Co-P 도금 피막의 석출거동에 미치는 영향
Effects of Complex Agents and pH on the Deposition Behavior of ElectrolessNi-Co-P Film
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Electroless plated Ni-Co-P films have been used to suppress the electromagnetic waves from magnetic recordingmedia, and the suppression is known to be achieved with films made with optimized plating compositionand plating condition. Effects of complexing agents on the deposition rate and bath stability of Ni-Co-Pfilm were studied using sodium citrate, sodium tartrate and multi-complex agents containing both of them. Deposition of electroless Ni-Co-P platings was dependent upon the complexing agents. Deposition rate wastwice when using sodium tartrate compared to that using sodium citrate. And it was slightly slower withmulti-complex agents than with sodium tartrate, bath stability being declined in the former. Deposition rateincreased with increasing pH until pH 11. Excellent bath stability and good deposition rate were obtained using multi-complex agent as sodium citrate0.10 mol/L and sodium tartrate 0.15 mol/L in the electroless Ni-Co-P plating films.
Abstract
Electroless plated Ni-Co-P films have been used to suppress the electromagnetic waves from magnetic recordingmedia, and the suppression is known to be achieved with films made with optimized plating compositionand plating condition. Effects of complexing agents on the deposition rate and bath stability of Ni-Co-Pfilm were studied using sodium citrate, sodium tartrate and multi-complex agents containing both of them. Deposition of electroless Ni-Co-P platings was dependent upon the complexing agents. Deposition rate wastwice when using sodium tartrate compared to that using sodium citrate. And it was slightly slower withmulti-complex agents than with sodium tartrate, bath stability being declined in the former. Deposition rateincreased with increasing pH until pH 11. Excellent bath stability and good deposition rate were obtained using multi-complex agent as sodium citrate0.10 mol/L and sodium tartrate 0.15 mol/L in the electroless Ni-Co-P plating films.
참고문헌 (11)
- D. Kim, , J. Surf. Finish. Soc. Jap, 46, pp.81~ (1995)
- C. Polk, "Handbook of Biological Effect of Electromagnetic Field" (1987), CRC Press
- K. Kim, , The Korean Institude of Electrical Engineers, 42, pp.5~ (1993)
- R. H. Mauch, "Efficient Blue Thin Film Electro luminescent Devices", pp.107~ (1992), Displays
- M. Matsoka, , J. Sur. Fin. Soc. Jpn, 42, pp.1058~ (1991)
- O. Takano, , J. Surf. Finish. Soc. Jap, 35, pp.440~
- O. Takano, "Application of electroless plating", pp.1377~ (1991), Nikkan Kogyo Shinbunsha
- O. Takano, , J. Surf. Finish. Soc. Jap, 35, pp.440~ (1984)
- H. Matsuda, , J. Surf. Finish. Soc. Jap, 35, pp.359~ (1984)
- Denki Meki Kenkyukai, "Next generation plating technology", pp.41~ (2004), Nikkan Kogyo Shinbunsha
- M. Pourbaix, "Atlas of Electrochemical Equilibria in Aqueous Solutions", pp.504~ (1966), Pergamon Press