건습식 혼합공정을 이용한 유연소재 상 전자파 차폐용 다층막 코팅
Multilayer Coatings on Flexible substrate for Electromagnetic Shielding by Using Dry/Wet Hybrid Processes
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초록
Dry processes like evaporation and sputtering in vacuum chamber are difficult to make a uniform, large area and high quality film on thin PET substrate because of PET degradation and bad adhesion. On the other hand, wet processes like electro or electroless plating have complex processes and require high environmental cost. In this study, we successfully prepared 2 μm Zn/Cu/Ni multilayers coated on 12 μm polyethylene terephthalate (PET) substrate by using dry-wet mixing processes. Their surface electric resistances were evaluated around 0.2 Ω by using 4 probe measurements. Furthermore, their corrosion resistance also evaluated by natural potential test and compared with other wet, dry and mixing process samples.
Abstract
Dry processes like evaporation and sputtering in vacuum chamber are difficult to make a uniform, large area and high quality film on thin PET substrate because of PET degradation and bad adhesion. On the other hand, wet processes like electro or electroless plating have complex processes and require high environmental cost. In this study, we successfully prepared 2 μm Zn/Cu/Ni multilayers coated on 12 μm polyethylene terephthalate (PET) substrate by using dry-wet mixing processes. Their surface electric resistances were evaluated around 0.2 Ω by using 4 probe measurements. Furthermore, their corrosion resistance also evaluated by natural potential test and compared with other wet, dry and mixing process samples.
참고문헌 (6)
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