진공척 흡착패드 형태에 따른 대면적 임프린팅 균일 접촉 향상 연구
Study on the Enhancement of the Uniform Contact Technology for Large Scale Imprinting with the Design of Vacuum Gripping Pad
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초록
The contact surfaces between mold and target should be in parallel for a proper imprinting process. However, large size of contacting area makes it difficult for both mating surfaces (mold and target planes) to be in all uniform contact with the expected precision level in terms of thickness and position. This is caused by the waviness of mold and target although it is very small relative to the area scale. The gripping force for both mold and target by the vacuum chuck is other major effect to interrupt the uniform contact, which must be avoided in imprinting mechanism. In this study, the cause of non-conformal contact mechanism between mold and target is investigated with the consideration of deformation due to the vacuum gripping for the size 470×370 mm2 LCD panel.
Abstract
The contact surfaces between mold and target should be in parallel for a proper imprinting process. However, large size of contacting area makes it difficult for both mating surfaces (mold and target planes) to be in all uniform contact with the expected precision level in terms of thickness and position. This is caused by the waviness of mold and target although it is very small relative to the area scale. The gripping force for both mold and target by the vacuum chuck is other major effect to interrupt the uniform contact, which must be avoided in imprinting mechanism. In this study, the cause of non-conformal contact mechanism between mold and target is investigated with the consideration of deformation due to the vacuum gripping for the size 470×370 mm2 LCD panel.
참고문헌 (5)
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- Heyderman,L.J., "Flow Behavior of Thin Polymer Films used for Hot Embossing Lithography", Microelectronic EngineeringVol.54pp.229-245, 54, pp.229~245 (2000)
- Hamrock, B. J., "Fundamentals of Fluid Film Lubrication", McGraw-Hill
- Landis,S., "Stamp Design Effect on 100 nm Feature Size for 8 inch Nanoimprint Lithography", Nanotechnlogy, 17, pp.2701~2709 (2006)