UV임프린트 공정에서 임프린팅 가압력 및 가압시간에 따른 레진 잔막 두께형성에 대한 실험연구
Study on the Formation of Residual Layer Thickness by Changing Magnitude and Period of UV Imprinting Pressure
2
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
This study is focused on the resin layer formation of UV imprinting process by changing imprinting pressure and period. The mold shape is made for the process of window open over the pattern transfer area and the imprinting period is assigned as the time just before the UV light curing. The residual layer is measured by changing the imprinting period and pressure magnitude, and the measured data of residual layer provides useful information for the design of the process conditions of imprinting processes.
Abstract
This study is focused on the resin layer formation of UV imprinting process by changing imprinting pressure and period. The mold shape is made for the process of window open over the pattern transfer area and the imprinting period is assigned as the time just before the UV light curing. The residual layer is measured by changing the imprinting period and pressure magnitude, and the measured data of residual layer provides useful information for the design of the process conditions of imprinting processes.
참고문헌 (7)
- Hiroshima, Hiroshi, "Homogenity of Residual Layer Thickness in UV Nanoimprint Lithography", Japanese Journal of Applied Physics, 48, pp.06FH18-1~06FH18-4 (2009)
- Hiroshima, Hiroshi, "Nanoimprint with Thin and Uniform Residual Layer for Various Pattern Densities", Microelectronic Engineering, 86, pp.611~614 (2009)
- Hiroshima, Hiroshi, "UVnanoimprint with the Assistance of Gas Condensation at Atmospheric Environmental Pressure", Journal of Vacuum Science Technology, B, 25(6), pp.2333~2336
- Merino, S, "Stamp deformation and its Influence on Residual Layer Homogeneity in Thermal Nanoimprint Lithography", Microelectronic Engineering, 85, pp.877~880 (2008)
- Shao, J, "A Novel Overlay Process for Imprint Lithography Using Load Release and Alignment Error Pre- Compensation Method", Microelectronic Engineering, 85, pp.168~174 (2008)
- Liu, H, "A Novel Load and Demolding Process Control in UV Nanoimprint Lithography", Microelectronic Engineering, 86, pp.4~9 (2009)
- Sander F. Wuister, "Squeeze Time Investigations for Step and Flash Imprint Lithography", Microelectronic Engineering, 86, pp.681~683 (2009)