입자연마가공에서의 압력 속도 및 유체점도의 영향에 대한 고찰
A Study of the Effects of Pressure Velocity and Fluid Viscosity in Abrasive Machining Process
1
조회
0
다운로드
4
인용
0
참고문헌
키워드
초록
Interest in advanced machining process such as AJM(abrasive jet machining) and CMP(chemicalmechanical polishing) using micro/nano-sized abrasives has been on the increasing demand due to wide use of super alloys, composites, semiconductor and ceramics, which are difficult to or cannot be processed by traditional machining methods. In this paper, the effects of pressure, wafer moving velocity and fluid viscosity were investigated by 2-dimensional finite element analysis method considering slurry fluid flow. From the investigation, it could be found that the simulation results quite corresponded well to the Preston's equation that describes pressure/velocity dependency on material removal. The result also revealed that the stress and corresponding material removal induced by the collision of particle may decrease under relatively high wafer moving speed due to the slurry flow resistance. In addition, the increase in slurry fluid viscosity causes the reduction of material removal rate. It should be noted that the viscosity effect can vary with the shape of abrasive particle.
Abstract
Interest in advanced machining process such as AJM(abrasive jet machining) and CMP(chemicalmechanical polishing) using micro/nano-sized abrasives has been on the increasing demand due to wide use of super alloys, composites, semiconductor and ceramics, which are difficult to or cannot be processed by traditional machining methods. In this paper, the effects of pressure, wafer moving velocity and fluid viscosity were investigated by 2-dimensional finite element analysis method considering slurry fluid flow. From the investigation, it could be found that the simulation results quite corresponded well to the Preston's equation that describes pressure/velocity dependency on material removal. The result also revealed that the stress and corresponding material removal induced by the collision of particle may decrease under relatively high wafer moving speed due to the slurry flow resistance. In addition, the increase in slurry fluid viscosity causes the reduction of material removal rate. It should be noted that the viscosity effect can vary with the shape of abrasive particle.
참고문헌 (15)
- Lin, Y.-Y, "Simulations of a Stress and Contact Model in a Chemical Mechanical Polishing Process", Thin Solid Films, 517(21), pp.6027~6033 (2009)
- Saka, N, "Nano-Scale Scratching in Chemical-Mechanical Polishing", CIRP Annals - Manufacturing Technology, 57(1), pp.341~344 (2008)
- Bielawski, M, "Fe Modelling of Surface Stresses in Erosion-Resistant Coatings under Single Particle Impact", Wear, 262(1), pp.167~175 (2007)
- Wensink, H, "A Closer Look at the Ductile-Brittle Transition in Solid Particle Erosion", Wear, 253(9), pp.1035~1043 (2002)
- Sheldon, G, "On the Ductile Behavior of Nominally Brittle Materials During Erosive Cutting", J. Eng. Ind, 88(4), pp.387~392 (1966)
- Sheldon, G, "The Mechanism of Material Removal in the Erosive Cutting of Brittle Materials", J. Eng. Ind, 88(4), pp.393~400 (1966)
- Junkar, M, "Finite Element Analysis of Single-Particle Impact in Abrasive Water Jet Machining", International Journal of Impact Engineering, 32(7), pp.1095~1112 (2006)
- Ahmadi-Brooghani, S, "Modeling of Single-Particle Impact in Abrasive Water Jet Machining", International Journal of Mechanical Systems Science and Engineering, 1(4), pp.231~236 (2008)
- 성인하, "입자연마가공에서의 입자 형상의 영향에 대한 고찰", 한국윤활학회지, 26(4), pp.219~223 (2010), 한국윤활학회
- 성인하, "On the Relationship between Material Removal and Interfacial Properties at Particulate Abrasive Machining Process", 한국윤활학회지, 25(6), pp.404~408 (2009), 한국윤활학회
- Oliver, M. R, "Chemical Mechanical Polishing", Semiconductor International, 26(6), pp.130~ (2003)
- Bathe, K, "Finite Element Analysis of Fluid Flows Fully Coupled with Structural Interactions", Computers and Structures, 72(1), pp.1~16 (1999)
- "On the method of finite spheres in applications: towards the use with ADINA and in a surgical simulator", COMPUTATIONAL MECHANICS, 31(1-2), pp.27~, 37
- Li, Y, "Microelectronic Applications of Chemical Mechanical Planarization" (2007), Wiley-Interscience
- Feng, J, "Finite Element Simulation of Thermal Stress During Diffusion Bonding of Al2O3 Ceramic to Aluminium", Science and Technology of Welding and Joining, 8(2), pp.138~142 (2003)