SPICE를 사용한 3D NAND Flash Memory의Channel Potential 검증
The Verification of Channel Potential using SPICE in 3D NAND Flash Memory
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초록
본 논문에서는 SPICE를 사용한 16단 3D NAND Flash memory compact modeling을 제안한다. 동일한 structure와simulation 조건에서 Down Coupling Phenomenon(DCP)과 Natural Local Self Boosting(NLSB)에 대한 channel potential을Technology Computer Aided Design(TCAD) tool Atlas(SilvacoTM)와 SPICE로 simulation하고 분석했다. 그 결과 두 현상에대한 TCAD와 SPICE의 channel potential이 매우 유사한 것을 확인할 수 있었다. SPICE는 netlist를 통해 소자 structure를직관적으로 확인할 수 있다. 또한, simulation 시간이 TCAD에 비해 짧게 소요된다. 그러므로 SPICE를 이용하여 3D NANDFlash memory의 효율적인 연구를 기대할 수 있다.
Abstract
In this paper, we propose the 16-layer 3D NAND Flash memory compact modeling using SPICE. In the same structureand simulation conditions, the channel potential about Down Coupling Phenomenon(DCP) and Natural Local Self Boosting(NLSB) were simulated and analyzed with Technology Computer Aided Design(TCAD) tool Atlas(SilvacoTM) and SPICE,respectively. As a result, it was confirmed that the channel potential of TCAD and SPICE for the two phenomena werealmost same. The SPICE can be checked the device structure intuitively by using netlist. Also, its simulation time isshorter than TCAD. Therefore, using SPICE can be expected to efficient research on 3D NAND Flash memory.
참고문헌 (8)
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