Pitting Corrosion Inhibition of Sprinkler Copper Tubes via Forming of Cu-BTA Film on the Inner Surface of Corrosion pits
2
조회
0
다운로드
1
인용
0
참고문헌
키워드
초록
The feasibility of using benzotriazole (BTAH) to inhibit pitting corrosion in the sprinkler copper tubeswas investigated by filling the tubes with BTAH-water solution in 829 households at an eight-year-oldapartment complex. The water leakage rate was reduced by approximately 90% following BTAH treatmentduring 161 days from the previous year. The leakage of one of the two sprinkler copper tubes was investigatedwith optical microscopy, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectronspectroscopy, and X-ray diffraction analysis to determine the formation of Cu-BTA film inside the corrosionpits. All the inner components of the corrosion pits were coated with Cu-BTA films suggesting that BTAHmolecules penetrated the corrosion products. The Cu-BTA film was about 2 nm in thickness at the bottomof a corrosion pit. A layer of CuCl and Cu2O phases lies under the Cu-BTA film. This complex structureeffectively prevented the propagation of corrosion pits in the sprinkler copper tubes and reduced the waterleakage.
Abstract
The feasibility of using benzotriazole (BTAH) to inhibit pitting corrosion in the sprinkler copper tubeswas investigated by filling the tubes with BTAH-water solution in 829 households at an eight-year-oldapartment complex. The water leakage rate was reduced by approximately 90% following BTAH treatmentduring 161 days from the previous year. The leakage of one of the two sprinkler copper tubes was investigatedwith optical microscopy, scanning electron microscopy, energy dispersive spectroscopy, X-ray photoelectronspectroscopy, and X-ray diffraction analysis to determine the formation of Cu-BTA film inside the corrosionpits. All the inner components of the corrosion pits were coated with Cu-BTA films suggesting that BTAHmolecules penetrated the corrosion products. The Cu-BTA film was about 2 nm in thickness at the bottomof a corrosion pit. A layer of CuCl and Cu2O phases lies under the Cu-BTA film. This complex structureeffectively prevented the propagation of corrosion pits in the sprinkler copper tubes and reduced the waterleakage.
참고문헌 (28)
- S. H. Suh, , Eng. Fail. Anal, 64, pp.111~ (2016)
- Research report: Study on the cause of copper tube corrosion, "J-G. Kim", The Korean Institute of Surface Engineering, ~ (2016)
- M. Edwards, , J. Am. Water Works Assoc, 86, pp.74~ (1994)
- 서상희, "아황산나트륨을 이용한 스프링클러 동배관 공식 부식 방지", CORROSION SCIENCE AND TECHNOLOGY, 16(5), pp.265~272 (2017), 한국부식방식학회[DOI]
- M. M. Antonijevic, , Int. J. Electrochem. Sci, 3, pp.1~ (2008)
- A. Fateh, , Arabian J. Chem. (2017)
- Procter and Gamble, Ltd., "British Patent, 652339", ~ (1947)
- H. B Madsen, , Stud. in Cons, 12, pp.163~ (1967)
- I. Dugdale, , Corros. Sci, 3, pp.69~ (1963)
- C. Fiaud, , Proc. of the 8th European Symposium on Corrosion Inhibitors (8SEIC), pp.929~ (1995)
- S. Golfomitsou, , Proc. of Metal 2004, National Museum of Australia Canberra ACT (2004)
- E. A. Skrypnikova, , Int. J. Corros. Scale Inhib, 3, pp.59~ (2014)
- M. M. Musiani, , J. Electroanal. Chem, 217, pp.182~ (1987)
- V. Brusic, , J. Electrochem. Soc, 144, pp.436~ (1997)
- Korea Institute of Science and Technology, "Apparatus and methods for drain, vent, and water filling for wet type sprinkler systems", Korea Patent, 10-1938819, ~ (2019)
- D. A. Lytle, , Corros. Sci, 52, pp.1927~ (2010)
- J. F. Moulder, "Handbook of X-ray Photoelectron Spectroscopy" (1995), Physical Electronics, Inc.
- B. V. Appa Rao, , Thin Solid Films, 556, pp.337~ (2014)
- G. P. Cicileo, , Corros. Sci, 41, pp.1359~ (1999)
- "X-ray Photoelectron Spectroscopy"[URL]
- A. Kokalj, , Faraday Discuss, 180, pp.415~ (2015)
- Z. Ahmad, "Principles of corrosion engineering and corrosion control", pp.151~ (2006), Butterworth-Heinemann
- G. W. Poling, , Corros. Sci, 10, pp.359~ (1970)
- R. Walker, , Corrosion, 31, pp.97~ (1975)
- U. R. Evans, "The Corrosion and Oxidation of Metals, First Supplementary Volume" (1968), St. Martin’s Press
- T. Hashemi, , Electrochim. Acta, 33, pp.1123~ (1988)
- D. Tromans, , J. Electrochem. Soc, 138, pp.3235~ (1991)
- I. Milosev, , Chem. Biochem. Eng. Q, 23, pp.53~ (2009)
