실리콘 단결정 잉곳용 석영유리 도가니의 brownish ring에 대한 연구
A study on the brownish ring of quartz glass crucible for silicon single crystal ingot
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초록
반도체 웨이퍼용 실리콘 잉곳 제조과정에서 사용되는 석영유리 도가니 내측표면의brownish ring (BR)에 대해 연구하였다. BR의 크기는 20~30 µm이고 비대칭 갈색 고리형태이다. 도가니 위치에 따라 BR의 크기와 분포가 상이하며, Si 잉곳 성장시 도가니 온도가 가장 높은 round 부가 가장 크고 많았다. BR은 석영유리보다 열팽창계수가 큰 cristobalite를 함유하고 있어 표면 crack이 나타나는 것으로 판단된다. BR의 발색 현상과 p in hole은 산소 결손에 의한 것으로 생각된다.
Abstract
A brown ring (hereinafter referred to as BR) on the inner surface of a quartz glass crucible used in the manufacturing process of a silicon ingot for semiconductor wafers was studied. BR is 20~30 µm in size and has an asymmetric brown ring shape. The size and distribution of BR were different depending on the crucible location, and the size and distribution of BR were the largest and most abundant in the round part with the highest crucible temperature during Si ingot growth. BR contains cristobalite, which has a higher coefficient of thermal expansion than quartz glass, so it is considered that surface cracks appear. The color development of BR and pin holes are presumed to be due to oxygen vacancies.
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