황동석 생물학적 침출 관련 부동태층의 특성 및 저감 방안
Characteristics and Countermeasures of the Passivation Layers in Chalcopyrite Bioleaching
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황동석의 Cu(구리) 생물학적 침출이 효과적이지 못한 가장 큰 이유 중 하나는 침출시 광물표면에 생성되는 부동태층(Passivation Layer)인 것으로 알려져 있다. 따라서 본 연구에서는 기존 문헌을 검토하여 황동석 생물학적 침 출시 발생하는 부동태층의 특성과 저감방안에 대하여 정리하였다. 부동태층의 두께는 너무 얇아 직접 관찰은 어렵기 때문에 주로 전압-전류 분석이나 반응속도곡선의 형태를 통하여 부동태층의 존재와 영향을 예측한다. 부동태층을 구 성하는 성분은 다양하나 이 중 Jarosite 성분이 Cu 침출을 저해할 가능성이 높다. 또한 부동태 침출저해가 표면층 때문 이 아니라 황동석의 천연 반도체 특성에 의해 발생한다는 이견도 최근에 제시되었다. 황동석의 침출을 증진시키는 기 술은 고온성 미생물을 이용하는 방법, 촉매나 외부전극 물질을 첨가하는 방법 그리고 Jarosite를 억제 또는 제거하는 방법 등이 있다.
Abstract
One of the most significant reasons that Cu bioleaching in chalcopyrite has been economically unsuccessful until now is an occurrence of passivation layers along with oxidative dissolution. Therefore, this study summarized the previous studies on the characteristics and the countermeasures of the passivation layers generated in chalcopyrite bioleaching. The width of passivation layers is too small to be directly observed; instead, existence and impact of the layers have been identified through the indirect ways such as the voltammetry and the reaction kinetics. Passivation layers consist of various compounds, among which jarosite is possibly the most critical compound to inhibit Cu bioleaching from chalcopyrite. Interestingly, an alternative explanation was recently suggested that the passivation result from inherent semiconductor characteristics of chalcopyrite, not from the existence of any kind of coating layers. The techniques to overcome the passivation issues include utilization of thermophilic microorganisms, catalysts, or external electrodes, as well as suppression or removal of jarosite.
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