A Newly Developed Non-Cyanide Electroless Gold Plating Method Using Thiomalic Acid as a Complexing Agent and 2-Aminoethanethiol as a Reducing Agent
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A versatile method for performing non-cyanide electroless gold plating using thiomalic acid (TMA) as acomplexing agent and 2-aminoethanethiol (AET) as a reducing agent was investigated. It was found thatTMA was an excellent complexing agent for gold. It can be used in electroless gold plating baths at a neutral pH with a high solution stability, makes it a potential candidate to replace conventional toxic cyanide complex. It was found that one gold atomic ion could bind to two TMA molecules to form the [2TMAAu +] complex in a solution. AET can be used as a reducing agent in electroless gold plating solutions. The highest current density was obtained at electrode rotation rate of 250 to 500 rpm based on anodic and cathodic polarization curves with the mixed potential theory. Increasing AET concentration, pH, and temperature significantly increased the anodic polarization current density and shifted the plating potential toward a more negative value. The optimal gold ion concentration to obtain the highest current density was 0.01 M. The cathodic current was higher at a lower pH and a higher temperature. The current density was inversely proportional to TMA concentration.
Abstract
A versatile method for performing non-cyanide electroless gold plating using thiomalic acid (TMA) as acomplexing agent and 2-aminoethanethiol (AET) as a reducing agent was investigated. It was found thatTMA was an excellent complexing agent for gold. It can be used in electroless gold plating baths at a neutral pH with a high solution stability, makes it a potential candidate to replace conventional toxic cyanide complex. It was found that one gold atomic ion could bind to two TMA molecules to form the [2TMAAu +] complex in a solution. AET can be used as a reducing agent in electroless gold plating solutions. The highest current density was obtained at electrode rotation rate of 250 to 500 rpm based on anodic and cathodic polarization curves with the mixed potential theory. Increasing AET concentration, pH, and temperature significantly increased the anodic polarization current density and shifted the plating potential toward a more negative value. The optimal gold ion concentration to obtain the highest current density was 0.01 M. The cathodic current was higher at a lower pH and a higher temperature. The current density was inversely proportional to TMA concentration.
참고문헌 (35)
- Masaru Kato, "Some recent developments in non-cyanide gold plating for electronics applications", Gold Bulletin, 37(1-2), pp.37~44 (2004), Springer Science and Business Media LLC[DOI]
- R. J. Morrissey, "A versatile non-cyanide gold plating system", Plating and Surface Finishing, 80, pp.75~ (1993)
- Yutaka Okinaka, "Some recent topics in gold plating for electronics applications", Gold Bulletin, 31(1), pp.3~13 (1998), Springer Science and Business Media LLC[DOI]
- Tetsuya Osaka, "Development of new electrolytic and electroless gold plating processes for electronics applications", Science and Technology of Advanced Materials, 7(5), pp.425~437 (2006), Informa UK Limited[DOI]
- Hassan O. Ali, "A review of electroless gold deposition processes", Gold Bulletin, 17(4), pp.118~127 (1984), Springer Science and Business Media LLC[DOI]
- M. Huang, , 2017 18th International Conference onElectronic Packaging Technology (ICEPT) Conf, pp.1173~1178 (2017), IEEE
- Hideo Honma, "Plating technology for electronics packaging", Electrochimica Acta, 47(1-2), pp.75~84 (2001), Elsevier BV[DOI]
- Frank H. Reid, "Gold Plating Technology", Journal of The Electrochemical Society, 122(6), pp.188C~188C (1975), The Electrochemical Society[DOI]
- Peter Wilkinson, "Understanding gold plating", Gold Bulletin, 19(3), pp.75~81 (1986), Springer Science and Business Media LLC[DOI]
- Yutaka OKINAKA, "Electroless Gold Plating", Journal of the Surface Finishing Society of Japan, 42(11), pp.1077~1086 (1991), The Surface Finishing Society of Japan[DOI]
- K. Wang, , IEEE, SEMI 29th International lectronics Manufacturing Technology Symposium (IEEE Cat. No. 04CH37585), pp.2004[DOI]
- Y. Okinaka, "Electroless deposition of gold", pp.483~498 (2010), Wiley-VCH
- T. A. Green, "Electrodeposition of Gold from a Thiosulfate-Sulfite Bath for Microelectronic Applications", Journal of The Electrochemical Society, 150(3), pp.C104~ (2003), The Electrochemical Society[DOI]
- T. Inoue, , 45th Electronic Components and Technology Conf, pp.1059~1067 (1995), IEEE
- Y. Sato, "Cyanide-free electroless gold plating from a bath containing disulfitoaurate and thiourea or its derivatives", Plating and surface finishing, 81, pp.74~ (1994)
- T. Takeuchi, "Electroless Gold Plating Using L-cysteine as Reducing Agent & its Deposition Mechanism", Plating and surface finishing, 90, pp.56~ (2003)
- K. Vasilev, "Preparation of Gold Nanoparticles in an Aqueous Medium Using 2-Mercaptosuccinic Acid as Both Reduction and Capping Agent", Journal of Nanoscience and Nanotechnology, 8(4), pp.2062~2068 (2008), American Scientific Publishers[DOI]
- Anne M. Sullivan, "The Autocatalytic Deposition of Gold in Nonalkaline, Gold Thiosulfate Electroless Bath", Journal of The Electrochemical Society, 142(7), pp.2250~2255 (1995), The Electrochemical Society[DOI]
- Jiandong Hu, "Novel plating solution for electroless deposition of gold film onto glass surface", Surface and Coatings Technology, 202(13), pp.2922~2926 (2008), Elsevier BV[DOI]
- G. O. Mallory, "Electroless plating: fundamentals and applications", pp.401~ (1990), William Andrew
- Don Baudrand, "Electroless plating processes", Metal Finishing, 93(9), pp.55~57 (1995), Elsevier BV[DOI]
- C.G. Anderson, "Alkaline sulfide gold leaching kinetics", Minerals Engineering, 92, pp.248~256 (2016), Elsevier BV[DOI]
- T.N Vorobyova, "Electroless gold plating from a hypophosphite-dicyanoaurate bath", Surface and Coatings Technology, 176(3), pp.327~336 (2004), Elsevier BV[DOI]
- Matthew I. Jeffrey, "The Effect of Additives on the Electroless Deposition of Gold from a Thiosulfate-Ascorbic Acid Bath", ECS Transactions, 2(3), pp.267~279 (2006), The Electrochemical Society[DOI]
- Masaru KATO, "Electrochemical Behavior of Electroless Gold Plating with Ascorbic Acid as a Reducing Agent.", Journal of the Surface Finishing Society of Japan, 42(7), pp.729~735 (1991), The Surface Finishing Society of Japan[DOI]
- Yutaka Okinaka, "An Electrochemical Study of Electroless Gold-Deposition Reaction", Journal of The Electrochemical Society, 120(6), pp.739~ (1973), The Electrochemical Society[DOI]
- Gastón Corthey, "Synthesis and Characterization of Gold@Gold(I)−Thiomalate Core@Shell Nanoparticles", ACS Nano, 4(6), pp.3413~3421 (2010), American Chemical Society (ACS)[DOI]
- Daren J. LeBlanc, "Thiomalate complexes of gold(I) :preparation, characterization and crystal structures of 1:2gold to thiomalate complexes", Journal of the Chemical Society, Dalton Transactions, (18), pp.3263~3268 (1997), Royal Society of Chemistry (RSC)[DOI]
- A. Bard, "Standard potentials in aqueous solution", pp.313~ (2017), Routledge
- H.K.Lee, "Practical Surface Treatment Technology Series", Electroless Plating, 3, pp.44~ (2014)
- Hidemi NAWAFUNE, "Autocatalytic Electroless Silver Deposition Using 2-Aminoethanethiol as Reducing Agent.", Journal of the Surface Finishing Society of Japan, 50(10), pp.928~932 (1999), The Surface Finishing Society of Japan[DOI]
- Izumi Ohno, "Electrochemistry of electroless plating", Materials Science and Engineering: A, 146(1-2), pp.33~49 (1991), Elsevier BV[DOI]
- A. J. Bard, "Electrochemical Dictionary", pp.482~ (2008), Springer Science & Business Media
- M. L. Goldberger, "Collision theory", pp.32~ (2004), Courier Corporation
- W. Riedel, "Electroless nickel plating", ASM International, ~ (1991)