캐피라리 전기 영동법에 의한 비시안 무전해 Au 도금액의 분석
Analysis of cyanide free electroless Au plating solution by capillary elecrophoresis
0
조회
0
다운로드
2
인용
0
참고문헌
키워드
초록
In the non-cyanide-based electroless Au plating solution using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent, analysis of each component constituting the plating solution is essential for the analysis of the reaction mechanism. And component analysis in the plating solution is important for monitoring component changes in the plating process and optimizing the management method.
Abstract
In the non-cyanide-based electroless Au plating solution using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent, analysis of each component constituting the plating solution is essential for the analysis of the reaction mechanism. And component analysis in the plating solution is important for monitoring component changes in the plating process and optimizing the management method.
참고문헌 (41)
- J. W. Schulze, "Microelectronic packaging" (2005), CRC Press
- J. Jasper, "Gold bumps offthe danger list", European Semiconductor, 22, pp.86~ (2000)
- E. L. Wooten, "A review of lithium niobate modulators for fiberoptic communications systems", IEEE J. Sel. Top. Quantum Electron, 6, pp.69~ (2000)
- W. J. Daukler, "A new operating regime for electroplating the gold absorber on x-ray masks", Microelectron. Eng, 23, pp.235~238 (1994)
- W. Chu, "Low-stress gold electroplating for X-ray masks", Microelectron. Eng, 17, pp.223~226 (1992)
- T. Osaka, "Development of new electrolytic and electroless gold plating processes for electronics applications", Sci. Technol. Adv. Mater, 7, pp.425~437 (2006)
- Y. Yoneda, "Packaging technology for imaging LSI", Fujitsu, 63, pp.489~495 (2012)
- Y. Ejiri, "Electroless Ni", Pd, J. Japan Inst. Electron. Packag, pp.2012, 15[DOI]
- T. Hiramori, "Interfacial reaction and joint strength of Sn-Ag base solders on electroless Ni-P", Au plating, 2003, pp.6, 503~508
- B. Li, "Acceleration effect of Na2S2O3 on the immersion gold plating on Ni-P surface from a sulfite based electrolyte", Surf. Coat. Technol, 302, pp.202~207 (2016)
- T. Osaka, "Development of new electrolytic and electroless gold plating processes for electronics applications", Sci. Technol. Adv. Mater, 7, pp.425~437 (2006)
- F. H. Reid, "Gold plating technology" (1974), Electrochemical Publications
- J. Ushio, "Electronic device plated with gold by means of an electroless gold plating solution", European Patent Application EP 021789, ~ (1987)
- I. Takashi, "Development of a non-cyanide electroless gold plating bath", Surf. Finish. Soc. Jpn, 52, pp.410~ (2001)
- Y. Shindo, "Study of non-cyanide electroless gold plating", Proceeding of the 84th Surface Finishing Society of Japan, pp.163~ (1991)
- Y. Sato, "Cyanide-free electroless gold plating from a bath containing disulfitoaurate and thiourea or its derivatives", Plat. Surf. Finish, 81, pp.74~ (1994)
- A. Sullivan, "The autocatalytic deposition of gold in nonalkaline, gold thiosulfate electroless bath", J. Electrochem. Soc, 142, pp.2250~ (1995)
- T. Inoue, "Stable noncyanide electroless gold plating which is applicable to manufacturing of fine pattern printed wiring boards", Proceeding of 45th IEEE electronic Components Technology Conf., pp.1059~ (1995)
- I. Takashi, "A very stable non-cyanide electroless gold plating bath using thiourea and hydroquinone as a cooperating double reductant system", J. Surf. Finish. Soc. Jpn, 49, pp.1298~1304 (1998)
- M. Kato, "Electrochemical behavior of electroless gold plating with ascorbic acid as a reducing agent", J. Surf. Finish. Soc. Jpn, 42, pp.729~ (1991)
- M. Kato, "Electroless gold plating bath using ascorbic acid as reducing agent – Recent improvement", Proceedings of the AESF Technical Conference, pp.805~ (1995)
- H. Honma, "Electroless gold plating by disulfiteaurate complex", Plating Surf. Finish, 82, pp.89~92 (1995)
- N. Hattori, "Electroless gold plating technology for usage of ascorbic acid as reducing agent", Proceedings of the 2001 ICEP, pp.166~ (2001)
- H. Nawafune, "Modern plating technology", Daily Industrial Newspaper 83, 180~ (2014)
- Electroplating Research Society, "Environmentally-coordinated plating technology", Daily Industrial Newspaper, 62~ (2006)
- The Korean Institute of Surface Engineering, "Electroless plating", pp.44~ (2014), Practical Surface Treatment Technology
- T. Takeuchi, "Electroless gold plating using l-cysteine as reducing agent & its deposition mechanism", Plating Surf. Finish, 90, pp.56~61 (2003)
- Stuart A. Oehrle, "Determination of inorganic and organic ions in nickel-plating baths by capillary electrophoresis", Journal of Chromatography A, 739(1-2), pp.413~419 (1996), Elsevier BV[DOI]
- Ling Zhang, "Analysis of electroplating baths by capillary electrophoresis with high voltage contactless conductivity detection", Measurement Science and Technology, 17(12), pp.3317~3322 (2006), IOP Publishing[DOI]
- H. Sun, "A new capillary electrophoresis buffer for determining organic and inorganic anions in electroplating bath with surfactant additives", J. Chromatogr. A, 1217, pp.3244~ (2010)
- A Timerbaev, "Element speciation analysis by capillary electrophoresis", Talanta, 52(4), pp.573~606 (2000), Elsevier BV[DOI]
- Marek Trojanowicz, "Recent developments in electrochemical flow detections—A review", Analytica Chimica Acta, 653(1), pp.36~58 (2009), Elsevier BV[DOI]
- A. Timerbaev, "Speciation studies by capillary electrophoresis- Simultaneous determination of chromium(III) and chromium(VI)", Fresenius J. Anal. Chem, 354, pp.414~ (1996)
- Tomoyoshi Soga, "Simultaneous determination of inorganic anions, organic acids and metal cations by capillary electrophoresis", Journal of Chromatography A, 834(1-2), pp.65~71 (1999), Elsevier BV[DOI]
- T. A. Green, "Speciation Analysis of Au(I) Electroplating Baths Containing Sulfite and Thiosulfate", Journal of The Electrochemical Society, 153(3), pp.C157~ (2006), The Electrochemical Society[DOI]
- V. Pacáková, "The importance of capillary electrophoresis, capillary electrochromatography, and ion chromatography in separations of inorganic ions", Electrophoresis, 24, pp.1883~ (2003)
- T. Soga, "Capillary electrophoresis method for the analysis of inorganic anions, organic acids, amino acids, nucleotides, carbohydrates and other anionic compounds", Electrophoresis, 22, pp.3418~ (2001)
- N. Tanaka, "Evaluation of the Interactions Between Palladium(II) and N,N'-Dimethyl-N,N'-di-n-hexyl-thiodiglycolamide in the Presence of Surfactants Using Capillary Electrophoresis", J. Sep. Sci, 40, pp.59~ (2019)
- L. Zhang, "Analysis of electroplating baths by capillary electrophoresis with high voltage contactless conductivity detection", Meas. Sci. Technol, 17, pp.3317~ (2006)
- E. Naujalis, "Speciation of Co(II), Co(III), and Cu(II) in ethylenediamine solutions by capillary electrophoresis", Anal. Bioanal. Chem, 376, pp.759~ (2003)
- T. Soga, "Capillary electrophoretic determination of inorganic and organic anions using 2,6-pyridinedicarboxylic acid:effect of electrolyte's complexing ability", J. Chromatogr. A, 767, pp.223~ (1997)
