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복합레진의 exponential 중합법이 상아질접착제의 미세인장접착강도에 미치는 영향

EFFECT OF THE EXPONENTIAL CURING OF COMPOSITE RESIN ON THE MICROTENSILE DENTIN BOND STRENGTH OF ADHESIVES

이인복|서덕규|조병훈|손호현|성소래
대한치과보존학회 (Korean Academy Of Conservative Dentistry)|2010.03|Restorative Dentistry and Endodontics|제35권 제2호|pp. 125-133

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키워드

Microtensile bond strengthFailure modePolymerization shrinkage파절양상중합수축Dentin adhesive상아질접착제미세인장접착강도Exponential 중합법Exponential curing
주제분류치의학

초록

접착제를 통해 치아에 접착되는 상부의 복합레진의 빠른 중합은 접착제층에 높은 중합수축응력을 발생시킨다. 중합수축응력을 경감시키기 위해서, LED 광중합기의 하나인 Elipar FreeLight 2 (3M ESPE, USA)에서는 최초 5초 이내에 광강도를 증가시키는 exponential 중합법을 채택하고 있다. 본 연구에서는 짧은 시간내에 광강도를 증가시키는 exponential 중합법이 복합레진의 초기 중합수축속도를 효과적으로 조절할 수 있는지를 알아보기 위해 접착제 적용 후 상부의 복합레진을 exponential 중합법과 continuous 중합법으로 중합하여 상아질접착제의 미세인장접착강도를 비교하였다. 3M사의 Scotchbond Multipurpose Plus (MP), Single Bond 2 (SB), 및 Adper Prompt (AP)의 세 종류의 접착제를 발치한 대구치의 교합면 상아질에 제조사의 지시에 따라 적용하고, 혼합형 복합레진인 Denfil (Vericom, Korea)을 두 가지 광중합방법으로 중합하였다. 접착 후 48시간에 미세인장접착강도를 측정하고, 파절면은 FE-SEM.으로 관찰하였다. 그 결과, 각각의 접착제에서 중합방법에 따른 접착강도의 차이는 관찰할 수 없었다(Two-way ANOVA, p > 0.05). MP와 SB의 미세인장접착강도는 AP에 비해 유의하게 높았다(p < 0.05). 대부분의 파절시편에서는 혼합형 파절이 가장 많이 관찰되었으나, 중합방법에 따른 파절양상의 차이는 없었다. 결론적으로 5초 이내의 짧은 시간에 광강도를 증가시키는 exponential 중합법은 continuous 중합법과 비교하여 상아질접착제의 미세인장접착강도에 영향을 주지 않았다.

Abstract

Objectives: Rapid polymerization of overlying composite resin causes high polymerization shrinkage stress at the adhesive layer. In order to alleviate the shrinkage stress, increasing the light intensity over the first 5 seconds was suggested as an exponential curing mode by an LED light curing unit (Elipar FreeLight2, 3M ESPE). In this study, the effectiveness of the exponential curing mode on reducing stress was evaluated with measuring microtensile bond strength of three adhesives after the overlying composite resin was polymerized with either continuous or exponential curing mode. Methods: Scotchbond Multipurpose Plus (MP, 3M ESPE), Single Bond 2 (SB, 3M ESPE), and Adper Prompt (AP, 3M ESPE) were applied onto the flat occlusal dentin of extracted human molar. The overlying hybrid composite (Denfil, Vericom, Korea) was cured under one of two exposing modes of the curing unit. At 48h from bonding, microtensile bond strength was measured at a crosshead speed of 1.0 mm/min. The fractured surfaces were observed under FE-SEM. Results: There was no statistically significant difference in the microtensile bond strengths of each adhesive between curing methods (Two-way ANOVA, p > 0.05). The microtensile bond strengths of MP and SB were significantly higher than that of AP (p < 0.05). Mixed failures were observed in most of the fractured surfaces, and differences in the failure mode were not observed among groups. Conclusion: The exponential curing method had no beneficial effect on the microtensile dentin bond strengths of three adhesives compared to continuous curing method. [J Kor Acad Cons Dent 35(2):125-133, 2010]

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