슬러리 공급 시스템을 이용한 화학적 기계적 연마 공정에서의POU 필터의 성능 평가
Evaluation of Point‐Of‐Use (POU) Filters Performance in Chemical Mechanical Polishing Slurry Supply System
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초록
The chemical mechanical polishing (CMP) process is widely used in semiconductor manufacturing process forplanarization of various materials and structures. Point‐of‐use (POU) filters are used in most of the CMP processes inorder to reduce the unwanted micro‐scratches which may result in defects. The performance of the POU filter isdepends on type and size of the abrasives used during cleaning process. For this reason, there is a need to evaluatePOU filters for their filtration efficiency (FE) with different types of abrasives. In this study, we developed filter testsystem to evaluate the FE of POU using ceria and silica abrasives (slurry). The POU filter is roll type capsule filterwith retention size of 0.2 ㎛. Two POU filters of different make are evaluated for FE. We observed that both POUfilters show similar filtration efficiency for silica and ceria slurry. Results reveal that the ceria slurry and the colloidalsilica particle are removed not only by mechanical way but also hydrodynamic and electrostatic interaction way
Abstract
The chemical mechanical polishing (CMP) process is widely used in semiconductor manufacturing process forplanarization of various materials and structures. Point‐of‐use (POU) filters are used in most of the CMP processes inorder to reduce the unwanted micro‐scratches which may result in defects. The performance of the POU filter isdepends on type and size of the abrasives used during cleaning process. For this reason, there is a need to evaluatePOU filters for their filtration efficiency (FE) with different types of abrasives. In this study, we developed filter testsystem to evaluate the FE of POU using ceria and silica abrasives (slurry). The POU filter is roll type capsule filterwith retention size of 0.2 ㎛. Two POU filters of different make are evaluated for FE. We observed that both POUfilters show similar filtration efficiency for silica and ceria slurry. Results reveal that the ceria slurry and the colloidalsilica particle are removed not only by mechanical way but also hydrodynamic and electrostatic interaction way
참고문헌 (12)
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