절연절단법을 이용한 프로브 빔의 제작
Fabrication of Probe Beam by Using Joule Heating and Fusing
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In this paper, we developed a beam of MEMS probe card using a BeCu sheet. Silicon wafer thickness of 400 m was fabricated by using deep reactive ion etching (RIE) process. After forming through silicon via (TSV), the silicon wafer was bonded with BeCu sheet by soldering process. We made BeCu beam stress-free owing to removing internal stress by using joule heating. BeCu beam was fused by using joule heating caused by high current. The fabricated BeCu beam measured length of 1.75 mm and width of 0.44 mm, and thickness of 15 m. We measured fusing current as a function of the cutting planes. Maximum current was 5.98 A at cutting plane of 150 m2. The proposed low-cost and simple fabrication process is applicable for producing MEMS probe beam.
Abstract
In this paper, we developed a beam of MEMS probe card using a BeCu sheet. Silicon wafer thickness of 400 m was fabricated by using deep reactive ion etching (RIE) process. After forming through silicon via (TSV), the silicon wafer was bonded with BeCu sheet by soldering process. We made BeCu beam stress-free owing to removing internal stress by using joule heating. BeCu beam was fused by using joule heating caused by high current. The fabricated BeCu beam measured length of 1.75 mm and width of 0.44 mm, and thickness of 15 m. We measured fusing current as a function of the cutting planes. Maximum current was 5.98 A at cutting plane of 150 m2. The proposed low-cost and simple fabrication process is applicable for producing MEMS probe beam.
참고문헌 (9)
- T. Tada, "A fine pitch probe technology for VLSI wafer testing", IEEE ITC, 900(906), pp.900~906 (1990)
- S. Sasho, "Four multi probing test for 16bit DAC with vertical contact probecard", IEEE ITC, 86(91), pp.86~91 (1996)
- 김영민, "Silicon Micro-probe Card Using Porous Silicon Micromachining Technology", ETRI Journal, 27(4), pp.433~438 (2005), 한국전자통신연구원
- B. Leslie, "Membrane probe card technology", IEEE ITC, 601(607), pp.601~607 (1988)
- C. H. Min, "Fabrication of vertical type probe card and MEMS probe card for wafer level chiptest", 석사, pp.2007
- E. Loh, "Physical analyses of data on fused-open bond wires", IEEE Trans. Comp., Hybrids, Manufact. Technol, 6(2), pp.209~217 (1983)
- E. Loh, "Heat transfer of fine-wire fuse", IEEE Trans. Comp., Hybrids, Manufact. Technol, 7(3), pp.264~267 (1984)
- A. Mertol, "Estimation of aluminum and gold bond wire fusing current and fusing time", IEEE trans. Components, packaging, Manuf. Technol. Part B, 18, pp.210~214 (1995)