BeCu 금속박판을 이용한 테스트 소켓 제작
Fabrication of Test Socket from BeCu Metal Sheet
2
조회
0
다운로드
0
인용
0
참고문헌
키워드
초록
We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ㎛, a width of 200 ㎛, a thickness of 10 ㎛, and a pitch of 650 ㎛ for 11×11 BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.
Abstract
We have developed a cost effective test socket for ball grid array(BGA) integrated circuit(IC) packages using BeCu metal sheet as a test probe. The BeCu furnishes the best combination of electrical conductivity and corrosion resistance. The probe of the test socket was designed with a BeCu cantilever. The cantilever was designed with a length of 450 ㎛, a width of 200 ㎛, a thickness of 10 ㎛, and a pitch of 650 ㎛ for 11×11 BGA. The fabrication of the test socket used techniques such as through-silicon-via filling, bonding silicon wafer and BeCu metal sheet with dry film resist(DFR). The test socket is applicable for BGA IC chip.
참고문헌 (17)
- Jongwoo Park, "Growth kinetics of interfacial damage : epoxy coatingon a generic dual inline package", IEEE Transactionson Components and Packaging Technologies, 24(3), pp.482~492 (2001)
- H. Hardisty, "Thermal analysis of a dual-in-line package using the finite-element method", IEE Proceedings, Part I - Solid-State and Electron Devices, 134, pp.23~31 (1987)
- A. Emerick, "Enhancement of TSOP solder joint reliability using encapsulation", Proceedings. 43rd Electronic Components and Technology Conference, pp.187~192 (1993)
- S. Sasaki, "High-pin-count quad flat package with thin-film termination resistors", Proceedings of 1993 Japan International Electronic Manufacturing Technology Symposium, pp.125~128 (1993)
- C. Y. Chung, "A novel package electrical characterization process-application on plastic BGA packages", Proceedings of the 1st Electronic Packaging Technology Conference, pp.304~309 (1997)
- L. Shan, "A low-cost ceramic BGA package for 50 Gb", s multiplexing circuit, 2003, pp.59(62), 59~62
- H. Hasan, "Effects of heat spreader on electrical characteristicsof tape-BGA packages", IEEE 6th Topical Meetingon Electrical Performance of Electronic Packaging, 153(156), pp.153~156 (1997)
- Rinebold, K., "Trends in BGA design methodologies", Proceedings of 1998 IEEE Symposium on IC, 1998, 120~123
- Ming-Kun Chen, "Electrical characterization of BGA test socket for high-speed applications", Proceedings of the 4th International Symposium on Electronic Materials and Packaging, pp.123~126 (2002)
- Da-Yuan Shih, "New ball grid array module test sockets", Proceedings of the Electronic Components & Technology Conference, 46(1), pp.467~470
- Benson Chan, "BGA sockets-A dendritic solution", Proceedings of the Electronic Components & Technology Conference, 46(1), pp.460~466 (1996)
- H. Koeppen, "Alloys C17400 and C17410-New beryllium copper alloys for connector applications", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 9(3), pp.310~316 (1986)
- I.J. Zatz, "Fracture testing of beryllium copper alloy C17510", Proceedings, 14th IEEE, 1991, pp.1, 276~279
- 김상원, "MEMS 공정을 이용한 BGA IC 패키지용 테스트 소켓의 제작", 전자공학회논문지 - SD, 47(11), pp.1~5 (2010), 대한전자공학회
- Bong-Hwan Kim, "A highly manufacturable large area array MEMS probe card using electroplating and flipchip bonding", IEEE Transactions on Industrial Electronics, 56(4), pp.1079~1085 (2009)
- Chanseob Cho, "Design and fabrication of highly manufacturable MEMS test sockets for BGA IC packages", Japanese Journal of Applied Physics, 50(6) (2011)
- J. Santander, "Accurate contact resistivity extraction on Kelvin structures with upper and lower resistive layers", IEEE Transactions on Electron Devices, 47(7), pp.1431~1439 (2000)