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혈압 측정을 위한 외팔보형 접촉힘 센서 어레이

A Cantilever Type Contact Force Sensor Array for Blood Pressure Measurement

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초록

Piezoresistive type contact force sensor array is fabricated by (111) Silicon bulk micromachining for continuous blood pressure monitoring. Length and width of the unit sensor structure is 200 μm and 190 μm, respectively. The gap between sensing elements is only 10 μm. To achieve wafer level packaging, the sensor structure is capped by PDMS soft cap using wafer molding and bonding process with 10 μm alignment precision. The resistance change over contact force was measured to verify the feasibility of the proposed sensor scheme. The maximum measurement range and resolution is 900 mm Hg and 0.57 mm Hg, respectively.

Abstract

Piezoresistive type contact force sensor array is fabricated by (111) Silicon bulk micromachining for continuous blood pressure monitoring. Length and width of the unit sensor structure is 200 μm and 190 μm, respectively. The gap between sensing elements is only 10 μm. To achieve wafer level packaging, the sensor structure is capped by PDMS soft cap using wafer molding and bonding process with 10 μm alignment precision. The resistance change over contact force was measured to verify the feasibility of the proposed sensor scheme. The maximum measurement range and resolution is 900 mm Hg and 0.57 mm Hg, respectively.

참고문헌 (7)

  1. Jong-Ho Kim, "Design of flexible tactile sensor based on three-component force and its fabrication", Proceedings of the 2005 IEEE International Conference on Robotics and Automation Barcelona, Spain, pp.2578~2581 (2005)
  2. K. Matthys, "Development and modeling of arterial applanation tonometry: A review", Technology and Health Care, 10, pp.65~76 (2002)
  3. "Apparatus for positioning transducer for blood pressure monitor", US Patent 4,987,900, ~
  4. S. Lee, "The surface", bulk micromachining(SBM) process: A new method for fabricating released MEMS in single crystal silicon, pp.8(4), 409~416
  5. D. Kwak, "Why is (111) silicon a better mechanical material for MEMS: torsion case", 2003 ASME Int. Mech. Eng. Congress (IMECE 2003), Washington D.C., USA, pp.15~21 (2003)
  6. S. D. Senturia, "Microsystem Design", Springer
  7. Byung-Ho Jo, "Three-dimensional micro-channel fabrication in polydimethylsiloxane (PDMS) elastomer", Journal of Microelectromechanical Systems, 9(1), pp.76~81 (2000)

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