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MEMS 기반 안전 소자에 대한 액정 폴리머 패키지의 밀폐도 연구

Investigation on hermeticity of liquid crystal polymer package for MEMS based safety device

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초록

Liquid crystal polymer (LCP) is a thermoplastic polymer with superior mechanical and thermal properties. In addition, its characteristics include very low water absorption rate and possibility to apply bonding process under low temperature. In this study, LCP is utilized as a packaging material for a microelectronic system (MEMS) based safety device with suggestion of a low temperature packaging process. Highly sensitive and stable capacitive type humidity sensor is fabricated to investigate hermeticity of the packaged MEMS device.

Abstract

Liquid crystal polymer (LCP) is a thermoplastic polymer with superior mechanical and thermal properties. In addition, its characteristics include very low water absorption rate and possibility to apply bonding process under low temperature. In this study, LCP is utilized as a packaging material for a microelectronic system (MEMS) based safety device with suggestion of a low temperature packaging process. Highly sensitive and stable capacitive type humidity sensor is fabricated to investigate hermeticity of the packaged MEMS device.

참고문헌 (8)

  1. Xuefeng Wang, "Liquid crystal polymer(LCP)for MEMS : processes and applications", J. Micromech. Microeng, 13, pp.628~633 (2003)
  2. J. H. Park, "Feasibility of liquid crystal polymer as an encapsulation material of photodiode-based high-resolution retinal prostheses", Invest. Ophthalmol. Vis. Sci., 55, pp.1829~ (2014)
  3. S. Chang Liu, "Recent Developments in Polymer MEMS", Adv. Mater, 19, pp.3783~3790 (2007)
  4. L. Gu, "A novel capacitive-type humidity sensor using CMOS fabrication technology", Sens. Actuators B, Chem, 99, pp.491~498 (2004)
  5. V. P. J. Chung, "Resorcinol-formaldehyde aerogels for CMOS-MEMS capacitive humidity sensor", Sens. Actuators B, Chem, 214, pp.181~188 (2015)
  6. A. Margomenos, "Fabrication and accelerated hermeticity testing of an on wafer packaging for RF MEMS", IEEE trans. on microwave theory and techniques, 52(6), pp.1626~1636 (2004)
  7. M. Dokmeci, "A high-sensitivity polyimide capacitive relative humidity sensor for monitoring anodically bonded hermetic micropackages", J. Mircroelectromech. Syst, 10, pp.197~203 (2001)
  8. B. Wang, "A systematical method to determine the internal pressure and hermeticity of MEMS package", J. Microelectromech. Syst, 23, pp.862~870 (2014)

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