Compact LTCC LPF Chip for Microwave Radar Sensor Applications
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초록
A 5th-order low-pass filter (LPF) chip implemented in a six-layer low-temperature co-fired ceramic (LTCC) dielectric substrate has been presented. Lumped elements constituting the LPF are designed three-dimensionally in multilayers. In order to improve the parasitic and mutual coupling effects between them, the LPF is designed by sequentially integrating the three-dimensional (3D) lumped elements,by comparing it to the results of the schematic circuit and 3D electromagnetic (EM) analysis. The designed 3D LPF chip was fabricatedin a six-layer LTCC substrate as small as 4.0 × 3.22 × 0.68 mm3. The measured return and insertion losses are less than -11 dB and -0.61 dB, respectively, below 1.5 GHz.
Abstract
A 5th-order low-pass filter (LPF) chip implemented in a six-layer low-temperature co-fired ceramic (LTCC) dielectric substrate has been presented. Lumped elements constituting the LPF are designed three-dimensionally in multilayers. In order to improve the parasitic and mutual coupling effects between them, the LPF is designed by sequentially integrating the three-dimensional (3D) lumped elements,by comparing it to the results of the schematic circuit and 3D electromagnetic (EM) analysis. The designed 3D LPF chip was fabricatedin a six-layer LTCC substrate as small as 4.0 × 3.22 × 0.68 mm3. The measured return and insertion losses are less than -11 dB and -0.61 dB, respectively, below 1.5 GHz.
참고문헌 (15)
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