Effect on the Residual Stress of Cure Profiles, Fillers and Mold Constraints in an Epoxy System
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A dilatometer was used to investigate the effect of cure conditions, mold types and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with the number of cyclic cures. Post cured samples outside the mold led to less shrinkage compared with samples in the mold. Sample cured in a silicon mold represented less shrinkage than sample cured in an aluminum mold. Sample containing kaolin filler showed less shrinkage than unfilled sample.
Abstract
A dilatometer was used to investigate the effect of cure conditions, mold types and the presence of filler in an epoxy system. These studies showed shrinkage in the cured epoxy when heating it through the glass transition temperature region. The magnitude of the shrinkage, related to stress build up in the epoxy during curing, was influenced by the processing conditions, filler presence and the nature of the mold used to contain the resin. Cure and cyclic cure at a lower temperature, prior to a post cure, decreased the magnitude of observed shrinkage. Cure shrinkage decreased with the number of cyclic cures. Post cured samples outside the mold led to less shrinkage compared with samples in the mold. Sample cured in a silicon mold represented less shrinkage than sample cured in an aluminum mold. Sample containing kaolin filler showed less shrinkage than unfilled sample.
참고문헌 (13)
- Adams, M.E., "Thermal-stress Induced Damage in a Thermoplastic Matrix Material for Advanced Composites", Polym. Eng. Sci., 31, pp.1337~1343 (1991)
- Adolf, D.B., "Stresses During Thermoset Cure", J. Mater. Res., 13, pp.530~550 (1998)
- Eijpe, M.P.I.M., "A Modified Layer Removal Method for Determination of Residual Stresses in Polymeric Composites" (1997), Mechanical Engineering, University Twente
- Favre, J.P., "Residual Thermal Stresses in Fibre Reinforced Composite Materials .a Review", J. Mech. Behav. Mater., 1, pp.37~53 (1988)
- Johnston, N.J., "Physical and Mechanical Properties of High-Performance Thermoplastic Polymers and their Composites. in: Thermoplastic composite materials", pp.27~71 (1991), Elsevier Science Publishers
- Kan, K.N., "Abnormal Course of Dilatometric Curve Near the Glass Transition Point", Polymer Science USSR, 17, pp.518~519 (1975)
- Kim, J.K., "Residual Stresses. In: Engineered Interfaces in Fiber Reinforced Composites", pp.308~320 (1998), Elsevier Science Ltd.
- Manson, J.A.E., "Process Simulated Laminate (Psl) . A Methodology to Internal-stress Characterization in Advanced Composite Materials", J. Compos. Mater., 26, pp.405~431 (1992)
- Plepys, A., "Determination of Residual Stresses using Incremental Linear Elasticity", Composite Structures, 27, pp.51~56 (1994)
- Prasatya, P., "A Viscoelastic Model for Predicting Isotropic Residual Stresses in Thermosetting Materials: Effects of Processing Parameters", J. Comp. Mater., 35, pp.826~848 (2001)
- Russel, J.D., "A New Method to Reduce Cure-Induced Stresses in Thermoset Polymer Composites, Part III: Correlating Stress History to Viscosity, Degree of Cure, and Cure Shrinkage", J. comp. Mater., 34, pp.1926~1947 (2000)
- Schulz, W.A., "Determination of Residual Stress and Thermal History for IM7", 977-2 Composite Laminates, 2005, pp.65, 2014~2024
- Unger, W.J., "Method to Predict the Effect of Thermal Residual Stresses on the Free-edge Delamination behavior of Fibre Reinforced Composite Laminates", J. Compos. Mater., 32, pp.431~459 (1998)