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Digital Micromirror Device와 Polygon scanner의 광학적 차이에 따른 Lithography 특성 분석

Industrial analysis according to lithography characteristics of digital micromirror device and polygon scanner

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In the early days of laser invention, it was simply used as a measuring tool, but as lasers became morecommon, they became an indispensable processing tool in the industry. Short-wavelength lasers are used to make patternson wafers used in semiconductors depending on the wavelength, such as CO2 laser, YAG laser, green laser, and UVlaser. At first, the hole of the PCB board mainly used for electronic parts was not thin and the hole size was large, soa mechanical drill was used. However, in order to realize product miniaturization and high integration, small holeprocessing lasers have become essential, and pattern exposure for small hole sizes has become essential. This paperintends to analyze the characteristics through patterns by exposing the PCB substrate through DMD and polygon scanner,which are different optical systems. Since the optical systems are different, the size of the patterns was made the same,and exposure was performed under the optimal conditions for each system. Pattern characteristics were analyzed througha 3D profiler. As a result of the analysis, there was no significant difference in line width between the two systems. However, it was confirmed that dmd had better pattern precision and polygon scanner had better productivity.

Abstract

In the early days of laser invention, it was simply used as a measuring tool, but as lasers became morecommon, they became an indispensable processing tool in the industry. Short-wavelength lasers are used to make patternson wafers used in semiconductors depending on the wavelength, such as CO2 laser, YAG laser, green laser, and UVlaser. At first, the hole of the PCB board mainly used for electronic parts was not thin and the hole size was large, soa mechanical drill was used. However, in order to realize product miniaturization and high integration, small holeprocessing lasers have become essential, and pattern exposure for small hole sizes has become essential. This paperintends to analyze the characteristics through patterns by exposing the PCB substrate through DMD and polygon scanner,which are different optical systems. Since the optical systems are different, the size of the patterns was made the same,and exposure was performed under the optimal conditions for each system. Pattern characteristics were analyzed througha 3D profiler. As a result of the analysis, there was no significant difference in line width between the two systems. However, it was confirmed that dmd had better pattern precision and polygon scanner had better productivity.

참고문헌 (8)

  1. Cho M. W., "Maskless lithography technology using DMD for PCB exposure", Journal of the KSME, 50(6), pp.43~47 (2010)
  2. Rothschild M., "Recent Trend in Optical Lithography", Lincoln Laboratory Journal, 14(2), pp.221~236 (2003)
  3. Cho Y. K., "Development of Dual Head Direct Patterning System Based DMD-Galvanoscanner and Research of the Exposure Algorithm to Improve Pattern Accuracy", Ph. D., pp.2017
  4. De Loor R., "Polygon Laser Scanning : A need for speed in laser processing and micromachining", Laser Technik Journal, 11(3), pp.32~34 (2014)
  5. Dudley D., "Emerging digital micromirror device(DMD)applications", MOEMS display and imaging systems, 4985 (2003), International Society for Optics and Photonics
  6. Watanabe, M., "Telecentric optics for constant magnification imaging", IEEE Trans. Pattern Anal. Mach. Intell, 19, pp.1360~1365 (1995)
  7. Blatt P., "Laser Direct Imaging Benefits from Solid State Technology", Laser Assisted Net Shape Engineering vol. 5, Proceedings of the Lane, pp.1221~1224 (2007)
  8. Kondo, K., "Current evolution of electrodeposited copper bumps with photoresist angle", Journal of The Electrochemical Society, 145(3), pp.840~844 (1998)

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