광 PCB의 광 회로층 제작 및 패키징 기술
Fabrication for Optical Layer and Packaging Technology of Optical PCB
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초록
Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a newtechnology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness ofelectrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprintlithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. Weconfirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structurewhich has 45o tilted mirror surface for confirm the interconnection efficiency.
Abstract
Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a newtechnology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness ofelectrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprintlithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. Weconfirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structurewhich has 45o tilted mirror surface for confirm the interconnection efficiency.
참고문헌 (8)
- 김동민, "광 패키징 및 인터커넥션 기술", 마이크로전자 및 패키징학회지, 19(4), pp.13~18 (2012), 한국마이크로전자및패키징학회[DOI]
- 류진화, "광 PCB 및 패키징 기술", 마이크로전자 및 패키징학회지, 18(1), pp.7~13 (2011), 한국마이크로전자및패키징학회
- 김동민, "렌즈 일체형 광도파로를 이용한 고효율 수동 광 PCB 접속 구조 설계", 마이크로전자 및 패키징학회지, 19(2), pp.47~53 (2012), 한국마이크로전자및패키징학회[DOI]
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- F. Y. Chang, "Fabrication of Mg-based bulk metallic glass molds by thermal imprint process", Intermetallics, 30, pp.35~ (2012)
- J. J. Dumond, "High Resolution UV roll-toroll nanoimprinting of resin moulds and subsequent replication via thermal nanoimprint lithography", Nanotechnology, 23, pp.9~ (2012)
- J. H. Ryu, "Simple fabrication of a double-layer multi-channel optical waveguide using passive alignment", Optics Express, 19(2), pp.1183~ (2011)
- K. Dhima, "A novel processing procedure for Y", UV-NIT with negative tone resists, pp.110, 85~